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JPS57210653A - Manufacture of glass-sealed semiconductor device - Google Patents

Manufacture of glass-sealed semiconductor device

Info

Publication number
JPS57210653A
JPS57210653A JP8488182A JP8488182A JPS57210653A JP S57210653 A JPS57210653 A JP S57210653A JP 8488182 A JP8488182 A JP 8488182A JP 8488182 A JP8488182 A JP 8488182A JP S57210653 A JPS57210653 A JP S57210653A
Authority
JP
Japan
Prior art keywords
leads
glass
semiconductor device
manufacture
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8488182A
Other languages
Japanese (ja)
Inventor
Seishiro Owaki
Michio Tanimoto
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8488182A priority Critical patent/JPS57210653A/en
Publication of JPS57210653A publication Critical patent/JPS57210653A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the removal of a lead in a semiconductor device by securing a ceramic base to a flat lead frame, mounting a semiconductor element, wiring the element, then cutting a lead connecting part and bending the leads. CONSTITUTION:A ceramic base 18 is secured with glass to a flat lead frame 10 which has a plurality of leads 13, an inner frame 12 for connecting the leads and an outer frame 13, a semiconductor element is mounted on the surface, and the element is connected to inner leads 15 with fine metal wires. Thereafter, the element is covered and sealed with ceramic cap, the leads are then cut at the parts of lines A and B, and the leads are bent at the parts of holes 16. In this manner, bonding speed can be accelerated, and the removal of the leads from the base can be prevented.
JP8488182A 1982-05-21 1982-05-21 Manufacture of glass-sealed semiconductor device Pending JPS57210653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8488182A JPS57210653A (en) 1982-05-21 1982-05-21 Manufacture of glass-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8488182A JPS57210653A (en) 1982-05-21 1982-05-21 Manufacture of glass-sealed semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10166376A Division JPS5252370A (en) 1976-08-27 1976-08-27 Fabrication of glass-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS57210653A true JPS57210653A (en) 1982-12-24

Family

ID=13843109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8488182A Pending JPS57210653A (en) 1982-05-21 1982-05-21 Manufacture of glass-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS57210653A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (en) * 1971-09-30 1973-06-09
JPS503093U (en) * 1973-05-08 1975-01-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (en) * 1971-09-30 1973-06-09
JPS503093U (en) * 1973-05-08 1975-01-13

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