JPS57202759A - Plastic package semiconductor device - Google Patents
Plastic package semiconductor deviceInfo
- Publication number
- JPS57202759A JPS57202759A JP8770681A JP8770681A JPS57202759A JP S57202759 A JPS57202759 A JP S57202759A JP 8770681 A JP8770681 A JP 8770681A JP 8770681 A JP8770681 A JP 8770681A JP S57202759 A JPS57202759 A JP S57202759A
- Authority
- JP
- Japan
- Prior art keywords
- package
- glass layers
- semiconductor device
- faces
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain high waterproof and dampproof sealing at a plastic package semiconductor device by a method wherein the package to accommodate a semiconductor chip having lead wires is constituted of a pair of plastic package parts forming a tightly seaing cavity, and low melting point glass layers are adhered to the inside faces and the junction parts thereof. CONSTITUTION:A lead frame 11 mounting the semiconductor chip 1 is sealed with the upper part package 3 and the lower part package 4 provided respectively with the concave part at the confronting faces. At this constitution, the upper part package 3 and the lower part package 4 are molded and processed together in a dish type using a plastic material, and continuous low melting point glass layers 31, 41 are provided respectively on the mutually confronting concave parts, on the circumferential walls and on the contact faces thereof. To form the glass layers 31, 41 thereof, a mixture of liquid type, paste type or powder glass and a binder, etc., is used, and are adhered by heating at 120- 130 deg.C in an oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8770681A JPS57202759A (en) | 1981-06-08 | 1981-06-08 | Plastic package semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8770681A JPS57202759A (en) | 1981-06-08 | 1981-06-08 | Plastic package semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57202759A true JPS57202759A (en) | 1982-12-11 |
Family
ID=13922352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8770681A Pending JPS57202759A (en) | 1981-06-08 | 1981-06-08 | Plastic package semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57202759A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557144A (en) * | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
-
1981
- 1981-06-08 JP JP8770681A patent/JPS57202759A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5557144A (en) * | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
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