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JPS57200828A - Manufacture of thermopile - Google Patents

Manufacture of thermopile

Info

Publication number
JPS57200828A
JPS57200828A JP56084987A JP8498781A JPS57200828A JP S57200828 A JPS57200828 A JP S57200828A JP 56084987 A JP56084987 A JP 56084987A JP 8498781 A JP8498781 A JP 8498781A JP S57200828 A JPS57200828 A JP S57200828A
Authority
JP
Japan
Prior art keywords
compact
thermopile
sensor
bonding
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56084987A
Other languages
Japanese (ja)
Other versions
JPS629847B2 (en
Inventor
Masahiko Kato
Hiroshi Fukunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP56084987A priority Critical patent/JPS57200828A/en
Publication of JPS57200828A publication Critical patent/JPS57200828A/en
Publication of JPS629847B2 publication Critical patent/JPS629847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PURPOSE:To obtain the compact, highly integrated thermopile which is applied in a heat flow sensor and to implement a compact, thin configuration and mass production of the sensor by bonding two metal foils to a resin film, obtaining the required configuration by photoetching, and metallurgically bonding the connecting parts. CONSTITUTION:As two metals for a thermocouple, copper is used in a blank part in the Figure, and constantan is used in a hatched part. Both ends of two filament parts are connected and a series circuit is formed. In manufacturing, the copper and constantan foils are bonded to the resin film, and a required picture pattern is formed by the photoetching. The insides of both parts are put together, and the temperature of the connected part is increased to 260 deg.C by using gold as an intermediate metal. The pressure of 20 atmospheric pressure is applied, and the metallurgical bonding is instantaneously performed. Thus the thermopile 15 is completed. Therefore the compact, highly integrated device can be obtained, and it is applied in the heat flow sensor. The sensor can be made compact and thin, and the mass production can be implemented.
JP56084987A 1981-06-04 1981-06-04 Manufacture of thermopile Granted JPS57200828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56084987A JPS57200828A (en) 1981-06-04 1981-06-04 Manufacture of thermopile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56084987A JPS57200828A (en) 1981-06-04 1981-06-04 Manufacture of thermopile

Publications (2)

Publication Number Publication Date
JPS57200828A true JPS57200828A (en) 1982-12-09
JPS629847B2 JPS629847B2 (en) 1987-03-03

Family

ID=13845968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56084987A Granted JPS57200828A (en) 1981-06-04 1981-06-04 Manufacture of thermopile

Country Status (1)

Country Link
JP (1) JPS57200828A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2606213A1 (en) * 1986-11-05 1988-05-06 Scientif Tech Batiment Centre A NEW COMPOSITE MATERIAL OF FLEXIBLE PREFERENCE, MEASURING DEVICE FORMING A COMBINED FLOWMETER AND TEMPERATURE SENSOR COMPRISING SUCH A COMPOSITE MATERIAL AND METHOD OF PREPARING SUCH A MATERIAL
JPH06260686A (en) * 1992-10-28 1994-09-16 Japan Energy Corp Layered thermopile and manufacture thereof
JPWO2006004060A1 (en) * 2004-07-01 2008-04-24 アルゼ株式会社 Thermoelectric conversion module
JP2009208766A (en) * 2008-02-29 2009-09-17 Lockheed Martin Corp Thermocouple array for generating electrical power for lighter-than-air vehicle
JP2017211271A (en) * 2016-05-25 2017-11-30 株式会社デンソー Heat flow measurement device
WO2017204033A1 (en) * 2016-05-25 2017-11-30 株式会社デンソー Manufacturing method for heat flow measuring device
CN107543634A (en) * 2016-09-05 2018-01-05 北京卫星环境工程研究所 Striped formula radiant heat flux measurement apparatus based on fexible film thermoelectric pile
CN107543618A (en) * 2016-09-05 2018-01-05 北京卫星环境工程研究所 Circle foil radiant heat flux measurement apparatus based on fexible film thermoelectric pile

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2606213A1 (en) * 1986-11-05 1988-05-06 Scientif Tech Batiment Centre A NEW COMPOSITE MATERIAL OF FLEXIBLE PREFERENCE, MEASURING DEVICE FORMING A COMBINED FLOWMETER AND TEMPERATURE SENSOR COMPRISING SUCH A COMPOSITE MATERIAL AND METHOD OF PREPARING SUCH A MATERIAL
JPH06260686A (en) * 1992-10-28 1994-09-16 Japan Energy Corp Layered thermopile and manufacture thereof
JPWO2006004060A1 (en) * 2004-07-01 2008-04-24 アルゼ株式会社 Thermoelectric conversion module
JP2009208766A (en) * 2008-02-29 2009-09-17 Lockheed Martin Corp Thermocouple array for generating electrical power for lighter-than-air vehicle
JP2017211271A (en) * 2016-05-25 2017-11-30 株式会社デンソー Heat flow measurement device
WO2017204033A1 (en) * 2016-05-25 2017-11-30 株式会社デンソー Manufacturing method for heat flow measuring device
WO2017204034A1 (en) * 2016-05-25 2017-11-30 株式会社デンソー Heat flow measurement device
JP2017211270A (en) * 2016-05-25 2017-11-30 株式会社デンソー Manufacturing method for heat flow measurement device
CN107543634A (en) * 2016-09-05 2018-01-05 北京卫星环境工程研究所 Striped formula radiant heat flux measurement apparatus based on fexible film thermoelectric pile
CN107543618A (en) * 2016-09-05 2018-01-05 北京卫星环境工程研究所 Circle foil radiant heat flux measurement apparatus based on fexible film thermoelectric pile
CN107543634B (en) * 2016-09-05 2019-09-10 北京卫星环境工程研究所 Striped formula radiant heat flux measuring device based on fexible film thermoelectric pile

Also Published As

Publication number Publication date
JPS629847B2 (en) 1987-03-03

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