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JPS57200550A - Plating method - Google Patents

Plating method

Info

Publication number
JPS57200550A
JPS57200550A JP8737281A JP8737281A JPS57200550A JP S57200550 A JPS57200550 A JP S57200550A JP 8737281 A JP8737281 A JP 8737281A JP 8737281 A JP8737281 A JP 8737281A JP S57200550 A JPS57200550 A JP S57200550A
Authority
JP
Japan
Prior art keywords
electrodes
electroless plating
liquid
plating method
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8737281A
Other languages
Japanese (ja)
Inventor
Yasunori Zaisei
Yoshifumi Yamashita
Toshiyuki Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP8737281A priority Critical patent/JPS57200550A/en
Publication of JPS57200550A publication Critical patent/JPS57200550A/en
Pending legal-status Critical Current

Links

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To raise a precipitating speed, in an electroless plating method, by supplying current into a plating liquid.
CONSTITUTION: At least two electrodes are separately thrown into an electroless plating liquid and current is supplied between these electrodes to carry out electroless plating. By chemical plating under current supply as described above, a precipitating speed is raised remarkably. The reason of this phenomenon is not made sure but it is considered that H or a H2 gas generated from the electrodes promotes reduction of a metal ion and excitation of the liquid is generated by electric energy.
COPYRIGHT: (C)1982,JPO&Japio
JP8737281A 1981-06-05 1981-06-05 Plating method Pending JPS57200550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8737281A JPS57200550A (en) 1981-06-05 1981-06-05 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8737281A JPS57200550A (en) 1981-06-05 1981-06-05 Plating method

Publications (1)

Publication Number Publication Date
JPS57200550A true JPS57200550A (en) 1982-12-08

Family

ID=13913058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8737281A Pending JPS57200550A (en) 1981-06-05 1981-06-05 Plating method

Country Status (1)

Country Link
JP (1) JPS57200550A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4592808A (en) * 1983-09-30 1986-06-03 The Boeing Company Method for plating conductive plastics
JPH03207885A (en) * 1989-10-30 1991-09-11 Sky Alum Co Ltd Production of zinc type plated aluminum sheet
JPH04110471U (en) * 1991-03-14 1992-09-25 重孝 柏木 Decorative body for pseudo hook
KR100454634B1 (en) * 2001-11-06 2004-11-05 재단법인서울대학교산학협력재단 Fabricating method of Copper film
JP2019183179A (en) * 2018-03-31 2019-10-24 名古屋メッキ工業株式会社 Copper plating method of fiber
US10508351B2 (en) * 2017-03-16 2019-12-17 Lam Research Corporation Layer-by-layer deposition using hydrogen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4592808A (en) * 1983-09-30 1986-06-03 The Boeing Company Method for plating conductive plastics
JPH03207885A (en) * 1989-10-30 1991-09-11 Sky Alum Co Ltd Production of zinc type plated aluminum sheet
JPH04110471U (en) * 1991-03-14 1992-09-25 重孝 柏木 Decorative body for pseudo hook
KR100454634B1 (en) * 2001-11-06 2004-11-05 재단법인서울대학교산학협력재단 Fabricating method of Copper film
US10508351B2 (en) * 2017-03-16 2019-12-17 Lam Research Corporation Layer-by-layer deposition using hydrogen
JP2019183179A (en) * 2018-03-31 2019-10-24 名古屋メッキ工業株式会社 Copper plating method of fiber

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