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JPS57197897A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS57197897A
JPS57197897A JP8105681A JP8105681A JPS57197897A JP S57197897 A JPS57197897 A JP S57197897A JP 8105681 A JP8105681 A JP 8105681A JP 8105681 A JP8105681 A JP 8105681A JP S57197897 A JPS57197897 A JP S57197897A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8105681A
Other languages
Japanese (ja)
Inventor
Tsunefumi Mutoo
Shiyouzou Nohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8105681A priority Critical patent/JPS57197897A/en
Publication of JPS57197897A publication Critical patent/JPS57197897A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP8105681A 1981-05-29 1981-05-29 Method of producing printed circuit board Pending JPS57197897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8105681A JPS57197897A (en) 1981-05-29 1981-05-29 Method of producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8105681A JPS57197897A (en) 1981-05-29 1981-05-29 Method of producing printed circuit board

Publications (1)

Publication Number Publication Date
JPS57197897A true JPS57197897A (en) 1982-12-04

Family

ID=13735747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8105681A Pending JPS57197897A (en) 1981-05-29 1981-05-29 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS57197897A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482598A (en) * 1987-09-24 1989-03-28 Fujitsu Ltd Copper plating method for printed board
US4996995A (en) * 1988-06-27 1991-03-05 Kobishi Electric Co., Ltd. Ashtray
WO2016163049A1 (en) * 2015-04-08 2016-10-13 日立化成株式会社 Multilayer wiring board manufacturing method
JP2020017712A (en) * 2018-07-26 2020-01-30 健鼎（無錫）電子有限公司Ｔｒｉｐｏｄ （ＷＵＸＩ） Ｅｌｅｃｔｒｏｎｉｃ Ｃｏ．， Ｌｔｄ． Method of manufacturing circuit substrate structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482598A (en) * 1987-09-24 1989-03-28 Fujitsu Ltd Copper plating method for printed board
US4996995A (en) * 1988-06-27 1991-03-05 Kobishi Electric Co., Ltd. Ashtray
WO2016163049A1 (en) * 2015-04-08 2016-10-13 日立化成株式会社 Multilayer wiring board manufacturing method
JP2016201416A (en) * 2015-04-08 2016-12-01 日立化成株式会社 Multilayer wiring board manufacturing method
US10609823B2 (en) 2015-04-08 2020-03-31 Hitachi Chemical Company, Ltd. Method for manufacturing multilayer wiring board
JP2020017712A (en) * 2018-07-26 2020-01-30 健鼎（無錫）電子有限公司Ｔｒｉｐｏｄ （ＷＵＸＩ） Ｅｌｅｃｔｒｏｎｉｃ Ｃｏ．， Ｌｔｄ． Method of manufacturing circuit substrate structure

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