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JPS57194252A - Vapor depositing device by electron beam - Google Patents

Vapor depositing device by electron beam

Info

Publication number
JPS57194252A
JPS57194252A JP7903781A JP7903781A JPS57194252A JP S57194252 A JPS57194252 A JP S57194252A JP 7903781 A JP7903781 A JP 7903781A JP 7903781 A JP7903781 A JP 7903781A JP S57194252 A JPS57194252 A JP S57194252A
Authority
JP
Japan
Prior art keywords
vapor depositing
plate
vapor
angle
incident
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7903781A
Other languages
Japanese (ja)
Other versions
JPH0149786B2 (en
Inventor
Makoto Nagao
Akira Nahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP7903781A priority Critical patent/JPS57194252A/en
Priority to DE19823204337 priority patent/DE3204337A1/en
Publication of JPS57194252A publication Critical patent/JPS57194252A/en
Publication of JPH0149786B2 publication Critical patent/JPH0149786B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE:To increase the quantity of incident beams and to make it possible to maintain high vapor deposition efficiency in a vapor depositing device by electron beams by tilting a part of a reflection guiding plate outward at a suitable angle and making the beam incident diagonally to the surface of a vapor depositing material. CONSTITUTION:In a vapor depositing device by electron beams which vapor deposits a vapor depositing material diagonally at an angle alpha on a substrate 2 of a magnetic tape while winding the same on a cooling can 1 and feeding the same, an evaporating material 3 is contained in a hearth 4 and a reflection guiding plate 5 is provided thereon. The plate 5 consists of a vertical inside wall 5a, an outside wall 5b inclined outward by an angle beta (beta=10-60 deg.) and opposite vertical end walls 5c. It is possible to make an electron beam 6 incident to the surface of the material 3 from the direction inclined by an angle gamma (gamma>=10 deg.) from vertical direction. Therefore, it is possible to allow the beam 6 to arrive at the material 3 without interruption by a shutter plate 7 and ancillary equipment 8 and to maintain the high vapor deposition efficiency on account of the plate 5.
JP7903781A 1981-02-10 1981-05-25 Vapor depositing device by electron beam Granted JPS57194252A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP7903781A JPS57194252A (en) 1981-05-25 1981-05-25 Vapor depositing device by electron beam
DE19823204337 DE3204337A1 (en) 1981-02-10 1982-02-09 Process and apparatus for forming a thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7903781A JPS57194252A (en) 1981-05-25 1981-05-25 Vapor depositing device by electron beam

Publications (2)

Publication Number Publication Date
JPS57194252A true JPS57194252A (en) 1982-11-29
JPH0149786B2 JPH0149786B2 (en) 1989-10-26

Family

ID=13678712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7903781A Granted JPS57194252A (en) 1981-02-10 1981-05-25 Vapor depositing device by electron beam

Country Status (1)

Country Link
JP (1) JPS57194252A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222578A (en) * 1983-05-30 1984-12-14 Hitachi Condenser Co Ltd Vapor deposition device
JPS63204513A (en) * 1987-02-20 1988-08-24 Fuji Photo Film Co Ltd Apparatus for producing magnetic recording medium
KR101084194B1 (en) 2009-08-10 2011-11-17 삼성모바일디스플레이주식회사 Thin film deposition apparatus having a deposition mask
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222578A (en) * 1983-05-30 1984-12-14 Hitachi Condenser Co Ltd Vapor deposition device
JPS63204513A (en) * 1987-02-20 1988-08-24 Fuji Photo Film Co Ltd Apparatus for producing magnetic recording medium
US10689746B2 (en) 2009-05-22 2020-06-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US11920233B2 (en) 2009-05-22 2024-03-05 Samsung Display Co., Ltd. Thin film deposition apparatus
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US11624107B2 (en) 2009-05-22 2023-04-11 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084194B1 (en) 2009-08-10 2011-11-17 삼성모바일디스플레이주식회사 Thin film deposition apparatus having a deposition mask
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US10287671B2 (en) 2010-01-11 2019-05-14 Samsung Display Co., Ltd. Thin film deposition apparatus
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same

Also Published As

Publication number Publication date
JPH0149786B2 (en) 1989-10-26

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