[go: up one dir, main page]

JPS57193277A - Soldering device by laser - Google Patents

Soldering device by laser

Info

Publication number
JPS57193277A
JPS57193277A JP56078974A JP7897481A JPS57193277A JP S57193277 A JPS57193277 A JP S57193277A JP 56078974 A JP56078974 A JP 56078974A JP 7897481 A JP7897481 A JP 7897481A JP S57193277 A JPS57193277 A JP S57193277A
Authority
JP
Japan
Prior art keywords
laser
soldering
parts
path
optical path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56078974A
Other languages
Japanese (ja)
Other versions
JPS5812106B2 (en
Inventor
Masakazu Nakazono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56078974A priority Critical patent/JPS5812106B2/en
Publication of JPS57193277A publication Critical patent/JPS57193277A/en
Publication of JPS5812106B2 publication Critical patent/JPS5812106B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To facilitate soldering in X and Y directions without turning a printed wiring substrate or moving laser optical systems by providing a prism for changing of optical path movably into and out of the laser optical path of the laser optical system for soldering. CONSTITUTION:The electronic parts 3, 4 to be soldered to the patterns 2 consisting of conductive films on a printed wiring substrate 1 are disposed respectively in X, Y directions, and the laser L oscillated from the laser oscillators 7 of laser optical systems 6a, 6b is condensed with condenser lenses 8 and is irradiated to soldering parts 5, 5, whereby solder materials 11, 11 are melted and parts are soldered. For the electronic parts 3 in the X direction, the path 9 is directed directly to the soldering parts 5, 5. For the parts 4 in the Y direction, said substrate 1 is moved by 1 pitch to locate the system 6a so as to face one soldering part 5 and a prism 10 for changing optical path is projected into the path 9 of the system 6b to refract the laser L, whereby said laser is irradiated to the other soldering part 5.
JP56078974A 1981-05-25 1981-05-25 Laser soldering equipment Expired JPS5812106B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56078974A JPS5812106B2 (en) 1981-05-25 1981-05-25 Laser soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56078974A JPS5812106B2 (en) 1981-05-25 1981-05-25 Laser soldering equipment

Publications (2)

Publication Number Publication Date
JPS57193277A true JPS57193277A (en) 1982-11-27
JPS5812106B2 JPS5812106B2 (en) 1983-03-07

Family

ID=13676867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56078974A Expired JPS5812106B2 (en) 1981-05-25 1981-05-25 Laser soldering equipment

Country Status (1)

Country Link
JP (1) JPS5812106B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165071U (en) * 1986-04-07 1987-10-20
JPS62199264U (en) * 1986-06-03 1987-12-18
JPH02175071A (en) * 1988-12-27 1990-07-06 Matsushita Electric Ind Co Ltd Laser mounting parts joining device
JPH0426666U (en) * 1990-06-27 1992-03-03
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
US6998572B2 (en) * 2001-09-28 2006-02-14 Matsushita Electric Industrial Co., Ltd. Light energy processing device and method
JP2007220958A (en) * 2006-02-17 2007-08-30 Toshiba Corp Solder bonding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165071U (en) * 1986-04-07 1987-10-20
JPS62199264U (en) * 1986-06-03 1987-12-18
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
JPH02175071A (en) * 1988-12-27 1990-07-06 Matsushita Electric Ind Co Ltd Laser mounting parts joining device
JPH0426666U (en) * 1990-06-27 1992-03-03
US6998572B2 (en) * 2001-09-28 2006-02-14 Matsushita Electric Industrial Co., Ltd. Light energy processing device and method
JP2007220958A (en) * 2006-02-17 2007-08-30 Toshiba Corp Solder bonding method

Also Published As

Publication number Publication date
JPS5812106B2 (en) 1983-03-07

Similar Documents

Publication Publication Date Title
DE3677937D1 (en) MODULE WITH TWO PRINTED CIRCUIT BOARDS.
EP0128401A3 (en) Additive or subtractive chemical process
EP0376541A3 (en) Removing meltable material
FR2297539A1 (en) ELECTRONIC DEVICE WITH A CAPILLARY CONNECTION AND METHOD FOR MANUFACTURING SUCH A DEVICE
JPS57193277A (en) Soldering device by laser
FR2585210B1 (en) METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
JPS6444295A (en) Laser beam trimming device
JPS5671173A (en) Pattern detection method of printed circuit substrate
SE9002663L (en) MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTS
FR2572972B1 (en) WELDING MACHINE.
JPS57106057A (en) Bump structure of ic
JPS5421753A (en) Linear pattern projector
JPS5545501A (en) Soldering tool
ATE45692T1 (en) THERMOPLASTIC SOLDER, METHOD AND APPARATUS.
JPS5756984A (en) Assembling method for semiconductor light emitting device
JPS5717369A (en) Method for soldering by laser
JPS53112061A (en) Wiring substrate of semiconductor chip
JPS6430034A (en) Semiconductor laser driver
JPS6427286A (en) Semiconductor device
JPS5929496A (en) Method of soldering multileg electronic part
JPS6427289A (en) Semiconductor device
JPS523391A (en) Mount used for semiconductor laser
IT1200402B (en) Wave soldering chips on circuit board
JPS6418049A (en) Inspection for mounting of chip part
JPS5327449A (en) Thickness measuring system for running body