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JPS57178660A - Slicer - Google Patents

Slicer

Info

Publication number
JPS57178660A
JPS57178660A JP6247981A JP6247981A JPS57178660A JP S57178660 A JPS57178660 A JP S57178660A JP 6247981 A JP6247981 A JP 6247981A JP 6247981 A JP6247981 A JP 6247981A JP S57178660 A JPS57178660 A JP S57178660A
Authority
JP
Japan
Prior art keywords
displacement
control device
height
amount
ingot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6247981A
Other languages
Japanese (ja)
Inventor
Takashi Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6247981A priority Critical patent/JPS57178660A/en
Publication of JPS57178660A publication Critical patent/JPS57178660A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve accuracy of thickness of a sliced wafer, by providing a displacement detector in the upper side of a balde, detecting the displacement in height of a blade edge prior to cutting and correcting a moving amount of a cut work by the displacement. CONSTITUTION:A pick-up 18 of a displacement detector 17, detecting the displacement in height of a diamond cutting edge 5, is arranged to the upper side of a blade 6, and an A/D coverter 19, converting detected information of the displacement detector 17 to a digital signal and feeding the signal to a control device 14, is provided. Immediately before cutting, if the height of the diamond cutting edge 5 is displaced, the displacement is detected by the pick-up 18, and its information is fed to the control device 14 through the A/D converter 19. The control device 14 calculates a lowering amount of an ingot 2 in accordance with the displacement to feed the amount to a pulse counter 13, and the ingot 2 is correctly lowered. In this way, unevenness in thickness of a sliced wafer 7 can be decreased to less than + or -10mum.
JP6247981A 1981-04-27 1981-04-27 Slicer Pending JPS57178660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6247981A JPS57178660A (en) 1981-04-27 1981-04-27 Slicer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6247981A JPS57178660A (en) 1981-04-27 1981-04-27 Slicer

Publications (1)

Publication Number Publication Date
JPS57178660A true JPS57178660A (en) 1982-11-02

Family

ID=13201355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6247981A Pending JPS57178660A (en) 1981-04-27 1981-04-27 Slicer

Country Status (1)

Country Link
JP (1) JPS57178660A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385324A2 (en) * 1989-02-27 1990-09-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Method for cutting rod-shaped work pieces into discs using an internal hole saw, and internal hole saw for this purpose
EP0417644A2 (en) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
JPH06117540A (en) * 1992-09-30 1994-04-26 Sadayoshi Taketsuna Gasket and its fitting method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0385324A2 (en) * 1989-02-27 1990-09-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Method for cutting rod-shaped work pieces into discs using an internal hole saw, and internal hole saw for this purpose
EP0417644A2 (en) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
JPH06117540A (en) * 1992-09-30 1994-04-26 Sadayoshi Taketsuna Gasket and its fitting method

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