JPS57168909A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPS57168909A JPS57168909A JP5544281A JP5544281A JPS57168909A JP S57168909 A JPS57168909 A JP S57168909A JP 5544281 A JP5544281 A JP 5544281A JP 5544281 A JP5544281 A JP 5544281A JP S57168909 A JPS57168909 A JP S57168909A
- Authority
- JP
- Japan
- Prior art keywords
- photocurable resin
- composition
- photosensitivity
- sensitizer
- processability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 3
- 206010034972 Photosensitivity reaction Diseases 0.000 abstract 2
- 239000003431 cross linking reagent Substances 0.000 abstract 2
- 238000010292 electrical insulation Methods 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 230000036211 photosensitivity Effects 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004185 ester group Chemical group 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: A photocurable resin composition excellent in photosensitivity, heat resistance, electrical insulation and processability, comprising a photocurable resin comprising a polyaminobismaleimide derivative, a crosslinking agent and a sensitizer.
CONSTITUTION: A composition comprising a photocurable resin of formulaI, wherein Ar1W5 are groups of formulas II and III, wherein R is H or CH3 and X is O, SO2 or CH2, P1 and P2 are each H or an aliphatic or aromatic residue containing an α,β-unsaturated ester group of formula IV or V, wherein R is H or CH3 and may be the same or different but must not be H at the same time and n is a positive integer, a crosslinking agent (e.g., ethylene glycol di(meth)acrylate) and a sensitizer (e.g., benzoin methyl ether). This composition is excellent in photosensitivity, heat resistance, electrical insulation and processability and is useful as a material acting as both an insulating material and a resist for the production of printed circuit boards, as a resist for the precise processing of semiconductors and as an organic insulating material.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5544281A JPS57168909A (en) | 1981-04-13 | 1981-04-13 | Photocurable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5544281A JPS57168909A (en) | 1981-04-13 | 1981-04-13 | Photocurable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57168909A true JPS57168909A (en) | 1982-10-18 |
Family
ID=12998701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5544281A Pending JPS57168909A (en) | 1981-04-13 | 1981-04-13 | Photocurable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57168909A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6709804B2 (en) * | 1999-01-25 | 2004-03-23 | Riken | Printed wiring board and semiconductor device and processes to prepare the same |
CN103773057A (en) * | 2014-01-08 | 2014-05-07 | 西安瑞联近代电子材料有限责任公司 | Novel solar dye-sensitized material, intermediate, preparation method and application thereof |
JPWO2013145043A1 (en) * | 2012-03-27 | 2015-08-03 | パナソニックIpマネジメント株式会社 | Build-up substrate, manufacturing method thereof, and semiconductor integrated circuit package |
-
1981
- 1981-04-13 JP JP5544281A patent/JPS57168909A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6709804B2 (en) * | 1999-01-25 | 2004-03-23 | Riken | Printed wiring board and semiconductor device and processes to prepare the same |
JPWO2013145043A1 (en) * | 2012-03-27 | 2015-08-03 | パナソニックIpマネジメント株式会社 | Build-up substrate, manufacturing method thereof, and semiconductor integrated circuit package |
CN103773057A (en) * | 2014-01-08 | 2014-05-07 | 西安瑞联近代电子材料有限责任公司 | Novel solar dye-sensitized material, intermediate, preparation method and application thereof |
CN103773057B (en) * | 2014-01-08 | 2015-07-29 | 西安瑞联近代电子材料有限责任公司 | A kind of new type solar energy dye sensitization material, intermediate and its preparation method and application |
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