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JPS57168909A - Photocurable resin composition - Google Patents

Photocurable resin composition

Info

Publication number
JPS57168909A
JPS57168909A JP5544281A JP5544281A JPS57168909A JP S57168909 A JPS57168909 A JP S57168909A JP 5544281 A JP5544281 A JP 5544281A JP 5544281 A JP5544281 A JP 5544281A JP S57168909 A JPS57168909 A JP S57168909A
Authority
JP
Japan
Prior art keywords
photocurable resin
composition
photosensitivity
sensitizer
processability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5544281A
Other languages
Japanese (ja)
Inventor
Akira Iwazawa
Shigeo Sugihara
Masao Morita
Haruyori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5544281A priority Critical patent/JPS57168909A/en
Publication of JPS57168909A publication Critical patent/JPS57168909A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: A photocurable resin composition excellent in photosensitivity, heat resistance, electrical insulation and processability, comprising a photocurable resin comprising a polyaminobismaleimide derivative, a crosslinking agent and a sensitizer.
CONSTITUTION: A composition comprising a photocurable resin of formulaI, wherein Ar1W5 are groups of formulas II and III, wherein R is H or CH3 and X is O, SO2 or CH2, P1 and P2 are each H or an aliphatic or aromatic residue containing an α,β-unsaturated ester group of formula IV or V, wherein R is H or CH3 and may be the same or different but must not be H at the same time and n is a positive integer, a crosslinking agent (e.g., ethylene glycol di(meth)acrylate) and a sensitizer (e.g., benzoin methyl ether). This composition is excellent in photosensitivity, heat resistance, electrical insulation and processability and is useful as a material acting as both an insulating material and a resist for the production of printed circuit boards, as a resist for the precise processing of semiconductors and as an organic insulating material.
COPYRIGHT: (C)1982,JPO&Japio
JP5544281A 1981-04-13 1981-04-13 Photocurable resin composition Pending JPS57168909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5544281A JPS57168909A (en) 1981-04-13 1981-04-13 Photocurable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5544281A JPS57168909A (en) 1981-04-13 1981-04-13 Photocurable resin composition

Publications (1)

Publication Number Publication Date
JPS57168909A true JPS57168909A (en) 1982-10-18

Family

ID=12998701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5544281A Pending JPS57168909A (en) 1981-04-13 1981-04-13 Photocurable resin composition

Country Status (1)

Country Link
JP (1) JPS57168909A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709804B2 (en) * 1999-01-25 2004-03-23 Riken Printed wiring board and semiconductor device and processes to prepare the same
CN103773057A (en) * 2014-01-08 2014-05-07 西安瑞联近代电子材料有限责任公司 Novel solar dye-sensitized material, intermediate, preparation method and application thereof
JPWO2013145043A1 (en) * 2012-03-27 2015-08-03 パナソニックIpマネジメント株式会社 Build-up substrate, manufacturing method thereof, and semiconductor integrated circuit package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709804B2 (en) * 1999-01-25 2004-03-23 Riken Printed wiring board and semiconductor device and processes to prepare the same
JPWO2013145043A1 (en) * 2012-03-27 2015-08-03 パナソニックIpマネジメント株式会社 Build-up substrate, manufacturing method thereof, and semiconductor integrated circuit package
CN103773057A (en) * 2014-01-08 2014-05-07 西安瑞联近代电子材料有限责任公司 Novel solar dye-sensitized material, intermediate, preparation method and application thereof
CN103773057B (en) * 2014-01-08 2015-07-29 西安瑞联近代电子材料有限责任公司 A kind of new type solar energy dye sensitization material, intermediate and its preparation method and application

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