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JPS57164118A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57164118A
JPS57164118A JP5027581A JP5027581A JPS57164118A JP S57164118 A JPS57164118 A JP S57164118A JP 5027581 A JP5027581 A JP 5027581A JP 5027581 A JP5027581 A JP 5027581A JP S57164118 A JPS57164118 A JP S57164118A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
low viscosity
pot life
component type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5027581A
Other languages
Japanese (ja)
Inventor
Masaharu Watanabe
Kimio Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd filed Critical Daicel Corp
Priority to JP5027581A priority Critical patent/JPS57164118A/en
Publication of JPS57164118A publication Critical patent/JPS57164118A/en
Pending legal-status Critical Current

Links

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled resin composition which is of the one-component type, has a long pot life at room temperature and, upon heating, cures rapidly, prepared by adding dicyandiamide and an imidazole derivative as a curing agent to an alicyclic epoxy resin.
CONSTITUTION: An epoxy resin composition prepared by mixing (A) 100pts.wt. alicyclic epoxy resin (e.g., 3,4-epoxycyclohexyl-methyl 3',4'-epoxycyclohexanecarboxylate) with (B) 1W20pts.wt. dicyandiamide and (C) 1.5W20pts.wt. imidazole derivative of the formula, wherein R1, R2 and R3 are each and alkyl, aryl, cycloalkyl or H, the total of components B and C being 3W30pts.wt. A resin composition which is of the one-component type, has low viscosity and a long pot life and, when heated, cures rapidly is obtained by dispersing compounds B and C in resin A having a low viscosity.
COPYRIGHT: (C)1982,JPO&Japio
JP5027581A 1981-04-03 1981-04-03 Epoxy resin composition Pending JPS57164118A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5027581A JPS57164118A (en) 1981-04-03 1981-04-03 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5027581A JPS57164118A (en) 1981-04-03 1981-04-03 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57164118A true JPS57164118A (en) 1982-10-08

Family

ID=12854383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5027581A Pending JPS57164118A (en) 1981-04-03 1981-04-03 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57164118A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0138209A2 (en) * 1983-10-14 1985-04-24 Hitachi, Ltd. Epoxy resin composition
JPS61192721A (en) * 1985-02-22 1986-08-27 Ajinomoto Co Inc One-pack epoxy resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147538A (en) * 1975-06-13 1976-12-17 Hitachi Ltd Adhesive composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147538A (en) * 1975-06-13 1976-12-17 Hitachi Ltd Adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0138209A2 (en) * 1983-10-14 1985-04-24 Hitachi, Ltd. Epoxy resin composition
JPS61192721A (en) * 1985-02-22 1986-08-27 Ajinomoto Co Inc One-pack epoxy resin composition

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