JPS57139975A - Manufacture of multi-digit light emitting diode display - Google Patents
Manufacture of multi-digit light emitting diode displayInfo
- Publication number
- JPS57139975A JPS57139975A JP56024576A JP2457681A JPS57139975A JP S57139975 A JPS57139975 A JP S57139975A JP 56024576 A JP56024576 A JP 56024576A JP 2457681 A JP2457681 A JP 2457681A JP S57139975 A JPS57139975 A JP S57139975A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- mount
- thin
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
PURPOSE:To improve multi-digit light emitting diode display constructing work efficiency by a method wherein a specific, geometric relationship is estabilished between the distance separating light-emitting diodes and the distance separating through hole provided thin plates. CONSTITUTION:A substrate 1 is provided with light emitting diode mounts 2, wiring bonds 3, through holes 4, and leads 5, and each mount 2 is separated from other mounts by a distance of (a). Each thin metal plate 6 provided with a through hole 7 for light emitting diode is separated from other plates by a distance (b), and is supported by a connecting bar 8. (Here, nb=ma, where n is a natural number larger than a natural number m.) First, in installing the thin plates on the substrate 1, the mount 2 at an end of the mount lineup is aligned upon the thin plate 6 also at the same end of the plate lineup. Next, every mth mount 2 is aligned upon every nth thin plate 6. The coinciding thin plates 6 and mounts 2 are bonded together by an adhesive and then separated from the connecting bar 8. The connecting bar 8 is then moved sidewise to the next and, as described, every nth thin plate 6 is bonded. The same is repeated. After this process, the light emitting diodes are mounted and bonded tight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56024576A JPS57139975A (en) | 1981-02-20 | 1981-02-20 | Manufacture of multi-digit light emitting diode display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56024576A JPS57139975A (en) | 1981-02-20 | 1981-02-20 | Manufacture of multi-digit light emitting diode display |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57139975A true JPS57139975A (en) | 1982-08-30 |
Family
ID=12141988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56024576A Pending JPS57139975A (en) | 1981-02-20 | 1981-02-20 | Manufacture of multi-digit light emitting diode display |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57139975A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59190462A (en) * | 1983-04-12 | 1984-10-29 | Nippon Denso Co Ltd | Fuel heating type fuel filter |
-
1981
- 1981-02-20 JP JP56024576A patent/JPS57139975A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59190462A (en) * | 1983-04-12 | 1984-10-29 | Nippon Denso Co Ltd | Fuel heating type fuel filter |
JPS6365822B2 (en) * | 1983-04-12 | 1988-12-16 | Nippon Denso Co |
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