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JPS57126159A - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
JPS57126159A
JPS57126159A JP1199881A JP1199881A JPS57126159A JP S57126159 A JPS57126159 A JP S57126159A JP 1199881 A JP1199881 A JP 1199881A JP 1199881 A JP1199881 A JP 1199881A JP S57126159 A JPS57126159 A JP S57126159A
Authority
JP
Japan
Prior art keywords
signal wire
integrated circuit
chips
match
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1199881A
Other languages
Japanese (ja)
Inventor
Mitsuru Nitta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1199881A priority Critical patent/JPS57126159A/en
Publication of JPS57126159A publication Critical patent/JPS57126159A/en
Pending legal-status Critical Current

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE: To make impedance matching to favorable and to obtain an ultrahigh-speed logic circuit of integrated circuit package by a method wherein a terminal resistor to match for characteristic impedance of a signal wire is provided on the ceramic substrate of an IC package, and it is connected to one end of a signal wire.
CONSTITUTION: Plural IC chips 2 consisting of plural logic gates 21, 22, input/ output terminals 25, 26, pads 31 positioned on the substrate 1 are mountded on the multilayers ceramic substrate 1 provided with a signal wire layer 3, an electric power source ground layer 4, a signal wire layer 5. The signal wire 41 to connect one pad 31 of a chip out of the chips 2 thereof to the pad of the other chip 2 is provided, and a terminal resistor 51 provided as to be positioned on the input terminal 26 side of the logic gate 22 and to match for characteristic impedance of the signal wire 41 is connected thereto. Impedance matching of the signal wire 41 is obtained by this way, multipath reflection and oscillation of signal pulse is prevented, and erroneous operation is negated.
COPYRIGHT: (C)1982,JPO&Japio
JP1199881A 1981-01-29 1981-01-29 Integrated circuit package Pending JPS57126159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1199881A JPS57126159A (en) 1981-01-29 1981-01-29 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1199881A JPS57126159A (en) 1981-01-29 1981-01-29 Integrated circuit package

Publications (1)

Publication Number Publication Date
JPS57126159A true JPS57126159A (en) 1982-08-05

Family

ID=11793249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1199881A Pending JPS57126159A (en) 1981-01-29 1981-01-29 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS57126159A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194350A (en) * 1987-02-09 1988-08-11 Fujitsu Ltd microwave circuit
JPS63256001A (en) * 1987-04-14 1988-10-24 Toshiba Corp Integrated circuit device
JPH01169946A (en) * 1987-12-24 1989-07-05 Fujitsu Ltd Semiconductor integrated circuit and its semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63194350A (en) * 1987-02-09 1988-08-11 Fujitsu Ltd microwave circuit
JPH0732227B2 (en) * 1987-02-09 1995-04-10 富士通株式会社 Microwave circuit
JPS63256001A (en) * 1987-04-14 1988-10-24 Toshiba Corp Integrated circuit device
JPH01169946A (en) * 1987-12-24 1989-07-05 Fujitsu Ltd Semiconductor integrated circuit and its semiconductor device

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