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JPS5712530A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS5712530A
JPS5712530A JP8659580A JP8659580A JPS5712530A JP S5712530 A JPS5712530 A JP S5712530A JP 8659580 A JP8659580 A JP 8659580A JP 8659580 A JP8659580 A JP 8659580A JP S5712530 A JPS5712530 A JP S5712530A
Authority
JP
Japan
Prior art keywords
joining
ball
capillary
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8659580A
Other languages
Japanese (ja)
Inventor
Kazuo Hirota
Yutaka Watanabe
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8659580A priority Critical patent/JPS5712530A/en
Publication of JPS5712530A publication Critical patent/JPS5712530A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48997—Reinforcing structures
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4941—Connecting portions the connecting portions being stacked
    • H01L2224/49429—Wedge and ball bonds
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85043—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
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    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase joining strength by expanding joining area, by executing ball joining in such a manner as to cover an end joining section. CONSTITUTION:After lead of a wire 1 was joined to an electrode 2 on a substrate 3 by ball joining 11, capillary is shifted and lowered, and end of the lead 1 is pressed and attached 12 to the electrode 2. The capillary is lifted and a ball 5 is made on tip of an Au wire 1 by hydrogen flame, and then, the capillary is lowered so that joining is made by pressing and attaching the ball 5 in such a manner as to cover the end joining region. It is possible, by using this mechanism, to increase joining strength by using a conventional joining equipment.
JP8659580A 1980-06-27 1980-06-27 Wire bonding method Pending JPS5712530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8659580A JPS5712530A (en) 1980-06-27 1980-06-27 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8659580A JPS5712530A (en) 1980-06-27 1980-06-27 Wire bonding method

Publications (1)

Publication Number Publication Date
JPS5712530A true JPS5712530A (en) 1982-01-22

Family

ID=13891348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8659580A Pending JPS5712530A (en) 1980-06-27 1980-06-27 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS5712530A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01158742A (en) * 1987-12-16 1989-06-21 Sanken Electric Co Ltd Manufacture of device with fine leads
JPH01251627A (en) * 1987-12-30 1989-10-06 Sanken Electric Co Ltd Manufacture of electric apparatus having thin lead wires
JPH0686339U (en) * 1993-05-28 1994-12-13 日本無線株式会社 Hybrid integrated circuit board
WO1999062114A1 (en) * 1998-05-27 1999-12-02 Robert Bosch Gmbh Method and contact point for producing a wire bonding connection
WO2006112393A1 (en) * 2005-04-15 2006-10-26 Rohm Co., Ltd. Semiconductor device and semiconductor device manufacturing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01158742A (en) * 1987-12-16 1989-06-21 Sanken Electric Co Ltd Manufacture of device with fine leads
JPH01251627A (en) * 1987-12-30 1989-10-06 Sanken Electric Co Ltd Manufacture of electric apparatus having thin lead wires
JPH0686339U (en) * 1993-05-28 1994-12-13 日本無線株式会社 Hybrid integrated circuit board
WO1999062114A1 (en) * 1998-05-27 1999-12-02 Robert Bosch Gmbh Method and contact point for producing a wire bonding connection
US6477768B1 (en) 1998-05-27 2002-11-12 Robert Bosch Gmbh Method and contact point for establishing an electrical connection
US7083077B2 (en) 1998-05-27 2006-08-01 Robert Bosch Gmbh Method and contact point for establishing an electrical connection
US7906858B2 (en) 1998-05-27 2011-03-15 Robert Bosch Gmbh Contact securing element for bonding a contact wire and for establishing an electrical connection
WO2006112393A1 (en) * 2005-04-15 2006-10-26 Rohm Co., Ltd. Semiconductor device and semiconductor device manufacturing method
JP2006302963A (en) * 2005-04-15 2006-11-02 Rohm Co Ltd Semiconductor device and method of manufacturing the same
US8604627B2 (en) 2005-04-15 2013-12-10 Rohm Co., Ltd. Semiconductor device

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