[go: up one dir, main page]

JPS57114293A - Manufacture of light emitting diode substrate - Google Patents

Manufacture of light emitting diode substrate

Info

Publication number
JPS57114293A
JPS57114293A JP56000843A JP84381A JPS57114293A JP S57114293 A JPS57114293 A JP S57114293A JP 56000843 A JP56000843 A JP 56000843A JP 84381 A JP84381 A JP 84381A JP S57114293 A JPS57114293 A JP S57114293A
Authority
JP
Japan
Prior art keywords
foil
groove
light emitting
emitting diode
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56000843A
Other languages
Japanese (ja)
Inventor
Makoto Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP56000843A priority Critical patent/JPS57114293A/en
Publication of JPS57114293A publication Critical patent/JPS57114293A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve the dimensional accuracy of a light emitting diode substrate by forming the second groove on a metallic foil having a wide width including the first groove on the metallic foil and placing fixedly a light emitting diode on the conductive foil of the bottom of the second groove. CONSTITUTION:A conductive foil 2 made of copper and a metallic foil 3 made of aluminum are sequentially laminated on an insulating substrate 1. The first resist film 4 is formed on the surface of the foil 3, is dipped in an aluminum etchant to form the first groove 6. Then, an etching window 8 is formed to form the second resist film 7 on the surface of the foil 3. Again, it is dipped in the aluminum etchant to form the second groove 9 having the oblique side wall of the first groove 6. Thereafter, the film 7 is removed, a desired pattern is formed on the foil 2, and a light emitting diode 12 such as GaP is placed fixedly with a conductive adhesive 11 or the like on the foil 2 of the bottom of the groove 9.
JP56000843A 1981-01-06 1981-01-06 Manufacture of light emitting diode substrate Pending JPS57114293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000843A JPS57114293A (en) 1981-01-06 1981-01-06 Manufacture of light emitting diode substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000843A JPS57114293A (en) 1981-01-06 1981-01-06 Manufacture of light emitting diode substrate

Publications (1)

Publication Number Publication Date
JPS57114293A true JPS57114293A (en) 1982-07-16

Family

ID=11484899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000843A Pending JPS57114293A (en) 1981-01-06 1981-01-06 Manufacture of light emitting diode substrate

Country Status (1)

Country Link
JP (1) JPS57114293A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100439402B1 (en) * 2001-12-24 2004-07-09 삼성전기주식회사 Light emission diode package
KR100785554B1 (en) 2006-05-24 2007-12-13 가부시끼가이샤 엘리먼트 덴시 Light emitting device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100439402B1 (en) * 2001-12-24 2004-07-09 삼성전기주식회사 Light emission diode package
KR100785554B1 (en) 2006-05-24 2007-12-13 가부시끼가이샤 엘리먼트 덴시 Light emitting device and method of manufacturing the same

Similar Documents

Publication Publication Date Title
ES8507730A1 (en) Method of forming ohmic contacts.
JPS57114293A (en) Manufacture of light emitting diode substrate
JPS5247692A (en) Printed circuit board for holding light emitting element
JPS5484932A (en) Forming method of multi-layer construction
JPS53118390A (en) Thin film luminous element
JPS5338262A (en) Semiconductor connection system
JPS52156375A (en) Method of producing multilayer circuit substrate
JPS5568655A (en) Manufacturing method of wiring
JPS6484224A (en) Electrode forming method
JPS5346666A (en) Method of producing multilayer circuit substrate
JPS5219297A (en) Method of manufacturing a metal film resistor
EP0136534A3 (en) Method of forming a large surface area integrated circuit
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS54148205A (en) Manufacture of moving member
JPS561378A (en) Cover glass for clock
JPS5760640A (en) Manufacture of compound shadow mask
JPS52117539A (en) Microwave circuit
JPS5297166A (en) Method of producing thick multilayer circuit substrate
JPS5711450A (en) Manufacture of fluorescent display tube
JPS5319560A (en) Method of producing multilayer circuit substrate
JPS5332378A (en) Method of producing multilayer circuit substrate
JPS5434663A (en) High-frequency/high-output integrated circuit
JPS57204602A (en) Dielectric filter
JPS55118654A (en) Manufacture of high density circuit substrate
JPS52154071A (en) Method of producing multilayer circuit substrate