JPS57113505A - Conductive composition - Google Patents

Conductive composition

Info

Publication number: JPS57113505A
Authority: JP; Japan
Prior art keywords: conductive composition; conductive; composition
Prior art date: 1981-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP152881A

Other languages

Japanese (ja)

Inventor

Hiroshi Hasegawa

Meiji Kukida

Tomio Ishida

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-01-07

Filing date

1981-01-07

Publication date

1982-07-15

1981-01-07 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1981-01-07 Priority to JP152881A priority Critical patent/JPS57113505A/en

1982-07-15 Publication of JPS57113505A publication Critical patent/JPS57113505A/en

Status Pending legal-status Critical Current

Landscapes

Paints Or Removers (AREA)
Conductive Materials (AREA)

JP152881A 1981-01-07 1981-01-07 Conductive composition Pending JPS57113505A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP152881A JPS57113505A (en)	1981-01-07	1981-01-07	Conductive composition

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP152881A JPS57113505A (en)	1981-01-07	1981-01-07	Conductive composition

Publications (1)

Publication Number	Publication Date
JPS57113505A true JPS57113505A (en)	1982-07-15

Family

ID=11504007

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP152881A Pending JPS57113505A (en)	1981-01-07	1981-01-07	Conductive composition

Country Status (1)

Country	Link
JP (1)	JPS57113505A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6049067A (en) *	1983-08-30	1985-03-18	Toshiba Chem Corp	Electrically conductive paint
US4857233A (en) *	1988-05-26	1989-08-15	Potters Industries, Inc.	Nickel particle plating system
US5376403A (en) *	1990-02-09	1994-12-27	Capote; Miguel A.	Electrically conductive compositions and methods for the preparation and use thereof
EP0651602A1 (en)	1993-10-29	1995-05-03	Matsushita Electric Industrial Co., Ltd.	Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
EP0708582A1 (en) *	1994-10-20	1996-04-24	International Business Machines Corporation	Electrically conductive paste materials and applications
US5837119A (en) *	1995-03-31	1998-11-17	International Business Machines Corporation	Methods of fabricating dendritic powder materials for high conductivity paste applications
US5837356A (en) *	1995-09-22	1998-11-17	Kyocera Corporation	Wiring board and method for manufacturing the same
US5851311A (en) *	1996-03-29	1998-12-22	Sophia Systems Co., Ltd.	Polymerizable flux composition for encapsulating the solder in situ
EP0886461A1 (en) *	1997-05-28	1998-12-23	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
US5853622A (en) *	1990-02-09	1998-12-29	Ormet Corporation	Transient liquid phase sintering conductive adhesives
US6238599B1 (en) *	1997-06-18	2001-05-29	International Business Machines Corporation	High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
US6465082B1 (en)	1997-11-19	2002-10-15	Matsushita Electric Industrial Co., Ltd.	Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
US6583201B2 (en)	2001-04-25	2003-06-24	National Starch And Chemical Investment Holding Corporation	Conductive materials with electrical stability for use in electronics devices
WO2006073004A1 (en) *	2005-01-06	2006-07-13	Shieldtechs, Inc.	Resin composition excellent in rust inhibition and electroconductivity, and member coated with the resin composition
WO2016007888A1 (en) *	2014-07-11	2016-01-14	Tyco Electronics Corporation	Electrical device

1981
- 1981-01-07 JP JP152881A patent/JPS57113505A/en active Pending

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6049067A (en) *	1983-08-30	1985-03-18	Toshiba Chem Corp	Electrically conductive paint
US4857233A (en) *	1988-05-26	1989-08-15	Potters Industries, Inc.	Nickel particle plating system
US5853622A (en) *	1990-02-09	1998-12-29	Ormet Corporation	Transient liquid phase sintering conductive adhesives
US5376403A (en) *	1990-02-09	1994-12-27	Capote; Miguel A.	Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) *	1990-02-09	1998-11-03	Toranaga Technologies, Inc.	Electrically conductive compositions and methods for the preparation and use thereof
EP0651602A1 (en)	1993-10-29	1995-05-03	Matsushita Electric Industrial Co., Ltd.	Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
EP0708582A1 (en) *	1994-10-20	1996-04-24	International Business Machines Corporation	Electrically conductive paste materials and applications
US5837119A (en) *	1995-03-31	1998-11-17	International Business Machines Corporation	Methods of fabricating dendritic powder materials for high conductivity paste applications
US5837356A (en) *	1995-09-22	1998-11-17	Kyocera Corporation	Wiring board and method for manufacturing the same
US5851311A (en) *	1996-03-29	1998-12-22	Sophia Systems Co., Ltd.	Polymerizable flux composition for encapsulating the solder in situ
US5989362A (en) *	1996-03-29	1999-11-23	Sophia Systems Co., Ltd.	Polymerizable flux composition for encapsulating the solder in situ
EP0886461A1 (en) *	1997-05-28	1998-12-23	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
US6054175A (en) *	1997-05-28	2000-04-25	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
US6238599B1 (en) *	1997-06-18	2001-05-29	International Business Machines Corporation	High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
US6465082B1 (en)	1997-11-19	2002-10-15	Matsushita Electric Industrial Co., Ltd.	Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
US6583201B2 (en)	2001-04-25	2003-06-24	National Starch And Chemical Investment Holding Corporation	Conductive materials with electrical stability for use in electronics devices
WO2006073004A1 (en) *	2005-01-06	2006-07-13	Shieldtechs, Inc.	Resin composition excellent in rust inhibition and electroconductivity, and member coated with the resin composition
WO2016007888A1 (en) *	2014-07-11	2016-01-14	Tyco Electronics Corporation	Electrical device

Publication	Publication Date	Title
GB2102004B (en)	1984-12-05	Conductive paste
GB2102026B (en)	1985-07-10	Conductive pastes
DE3261688D1 (en)	1985-02-07	Screen-printable composition
JPS5719904A (en)	1982-02-02	Conductive composition with adaptability
JPS57185943A (en)	1982-11-16	Conductive composition
JPS57113505A (en)	1982-07-15	Conductive composition
JPS57103204A (en)	1982-06-26	Conductive composition
DE3262847D1 (en)	1985-05-09	Heat-polymerisable compositions
JPS57147806A (en)	1982-09-11	Conductor composition
JPS57158905A (en)	1982-09-30	Conductive composition
JPS5734606A (en)	1982-02-25	Conductive composition
DE3263502D1 (en)	1985-06-20	Flavour-release compositions
GB2105190B (en)	1985-07-17	Light-screen compositions
JPS57175362A (en)	1982-10-28	Pasturizing composition
JPS57180007A (en)	1982-11-05	Dielectric porcelain composition
JPS57174806A (en)	1982-10-27	Dielectric porcelain composition
JPS57154705A (en)	1982-09-24	Dielectric composition
JPS5795005A (en)	1982-06-12	Conductive composition
GB2092587B (en)	1985-04-03	Substituted phenylcarbamoylbenzimidates
JPS57154704A (en)	1982-09-24	Dielectric composition
JPS57154707A (en)	1982-09-24	Dielectric composition
JPS56128504A (en)	1981-10-08	Conductive composition
JPS57152605A (en)	1982-09-21	Conductive paste
BG45985A1 (en)	1989-09-15	Electroconductive composition
IL65658A0 (en)	1982-08-31	Substituted 2-aminoethanols