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JPS57109357A - Copper alloy for semiconductor device lead - Google Patents

Copper alloy for semiconductor device lead

Info

Publication number
JPS57109357A
JPS57109357A JP18396780A JP18396780A JPS57109357A JP S57109357 A JPS57109357 A JP S57109357A JP 18396780 A JP18396780 A JP 18396780A JP 18396780 A JP18396780 A JP 18396780A JP S57109357 A JPS57109357 A JP S57109357A
Authority
JP
Japan
Prior art keywords
semiconductor device
copper alloy
device lead
solder
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18396780A
Other languages
Japanese (ja)
Other versions
JPS6213823B2 (en
Inventor
Masahiro Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Eneos Corp
Original Assignee
Nihon Kogyo KK
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Nippon Mining Co Ltd filed Critical Nihon Kogyo KK
Priority to JP18396780A priority Critical patent/JPS57109357A/en
Publication of JPS57109357A publication Critical patent/JPS57109357A/en
Publication of JPS6213823B2 publication Critical patent/JPS6213823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve lead material properties with regard to radiation of heat, resistance to high temperature, strength, application of solder, and adhesion of plating by a method wherein certain quantities of Ni and Si are added to Cu. CONSTITUTION:Cu containing inevitable impurities forms a Cu alloy including 0.4-4.0wt% Ni and 0.1-1.0wt% Si. Such a composition results in a Cu alloy for use with semiconductor devices as their leads that is excellent in heat radiation, resistance to high temperature, strength, application of solder, and adhesion of plating.
JP18396780A 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead Granted JPS57109357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18396780A JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18396780A JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Publications (2)

Publication Number Publication Date
JPS57109357A true JPS57109357A (en) 1982-07-07
JPS6213823B2 JPS6213823B2 (en) 1987-03-28

Family

ID=16144949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18396780A Granted JPS57109357A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Country Status (1)

Country Link
JP (1) JPS57109357A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8303605A (en) * 1982-10-20 1984-05-16 Poong San Metal Corp COPPER-NICKEL ALLOY AND METHOD FOR PRODUCING THE SAME

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011586B2 (en) * 2005-09-30 2012-08-29 Ｄｏｗａメタルテック株式会社 Copper alloy sheet with improved bending workability and fatigue characteristics and its manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS5315070A (en) * 1976-07-28 1978-02-10 Toshiba Corp Semiconductor device
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS5315070A (en) * 1976-07-28 1978-02-10 Toshiba Corp Semiconductor device
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8303605A (en) * 1982-10-20 1984-05-16 Poong San Metal Corp COPPER-NICKEL ALLOY AND METHOD FOR PRODUCING THE SAME
US4466939A (en) * 1982-10-20 1984-08-21 Poong San Metal Corporation Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts

Also Published As

Publication number Publication date
JPS6213823B2 (en) 1987-03-28

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