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JPS57107064A - Lead frame for glass sealed package - Google Patents

Lead frame for glass sealed package

Info

Publication number
JPS57107064A
JPS57107064A JP18457680A JP18457680A JPS57107064A JP S57107064 A JPS57107064 A JP S57107064A JP 18457680 A JP18457680 A JP 18457680A JP 18457680 A JP18457680 A JP 18457680A JP S57107064 A JPS57107064 A JP S57107064A
Authority
JP
Japan
Prior art keywords
frame
leads
lead frame
sealed package
internal ends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18457680A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yamamichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP18457680A priority Critical patent/JPS57107064A/en
Publication of JPS57107064A publication Critical patent/JPS57107064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To allow automatization of bonding process by preventing positional deviation of internal ends of leads by reinforcing them solidly with a frame of insulating material bonded around internal ends of leads of a lead frame. CONSTITUTION:A frame of ceramic 2 or the like is fusion-bonded, for example, with low-fusing-point glass 3 around internal ends of the leads of the lead frame 1 made of thin metal sheets using press dies or the like. Positioning and bonding of the frame 2 is carried out by properly setting dimensions of the frame 2 and the cavity so as to fit in the cavity into which the element is mounted. Solidification and reinforcement in such a process enables the bonding process to be automatized by preventing positional deviation of ends of the leads.
JP18457680A 1980-12-25 1980-12-25 Lead frame for glass sealed package Pending JPS57107064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18457680A JPS57107064A (en) 1980-12-25 1980-12-25 Lead frame for glass sealed package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18457680A JPS57107064A (en) 1980-12-25 1980-12-25 Lead frame for glass sealed package

Publications (1)

Publication Number Publication Date
JPS57107064A true JPS57107064A (en) 1982-07-03

Family

ID=16155616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18457680A Pending JPS57107064A (en) 1980-12-25 1980-12-25 Lead frame for glass sealed package

Country Status (1)

Country Link
JP (1) JPS57107064A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
WO1990006593A1 (en) * 1988-12-07 1990-06-14 Tribotech Tape automated bonded lead package and reusable transport tape for use therewith
US5184207A (en) * 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
WO1990006593A1 (en) * 1988-12-07 1990-06-14 Tribotech Tape automated bonded lead package and reusable transport tape for use therewith
US5184207A (en) * 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame

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