JPS57102063A - Lead-tape - Google Patents
Lead-tapeInfo
- Publication number
- JPS57102063A JPS57102063A JP55178497A JP17849780A JPS57102063A JP S57102063 A JPS57102063 A JP S57102063A JP 55178497 A JP55178497 A JP 55178497A JP 17849780 A JP17849780 A JP 17849780A JP S57102063 A JPS57102063 A JP S57102063A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- electrodes
- tape carrier
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To position a lead for connecting the electrodes of a semiconductor element and the electrodes accurately by forming a connecting section of the lead and a tape carrier supporting the lead at a position where the lead keeps a plane to the semiconductor element at all times. CONSTITUTION:The connecting section of the leads 4' for connecting the electrodes of the semiconductor elements 5' and the tape carrier 3' supporting the leads 4' is positioned so that the leads 4' keep planes to the semiconductor elements 5' at all times. A guide leads 2' is moved, and the electrodes of the semi conductor elements 5' and the leads 4' on the tape carrier 3' are positioned, and bonded by means of a bonding tool 1'.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55178497A JPS57102063A (en) | 1980-12-17 | 1980-12-17 | Lead-tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55178497A JPS57102063A (en) | 1980-12-17 | 1980-12-17 | Lead-tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57102063A true JPS57102063A (en) | 1982-06-24 |
JPS6161705B2 JPS6161705B2 (en) | 1986-12-26 |
Family
ID=16049483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55178497A Granted JPS57102063A (en) | 1980-12-17 | 1980-12-17 | Lead-tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57102063A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7359762B2 (en) | 2002-04-18 | 2008-04-15 | Black & Decker Inc. | Measurement and alignment device including a display system |
US20060076385A1 (en) | 2002-04-18 | 2006-04-13 | Etter Mark A | Power tool control system |
US7073268B1 (en) | 2002-04-18 | 2006-07-11 | Black & Decker Inc. | Level apparatus |
US7369916B2 (en) | 2002-04-18 | 2008-05-06 | Black & Decker Inc. | Drill press |
US7137327B2 (en) | 2002-10-31 | 2006-11-21 | Black & Decker Inc. | Riving knife assembly for a dual bevel table saw |
US7290474B2 (en) | 2003-04-29 | 2007-11-06 | Black & Decker Inc. | System for rapidly stopping a spinning table saw blade |
US7243440B2 (en) | 2004-10-06 | 2007-07-17 | Black & Decker Inc. | Gauge for use with power tools |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933569A (en) * | 1972-07-26 | 1974-03-28 | ||
JPS521067U (en) * | 1976-06-18 | 1977-01-06 | ||
JPS5337459U (en) * | 1976-09-07 | 1978-04-01 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS521067B2 (en) * | 1971-09-29 | 1977-01-12 | ||
JPS5231184A (en) * | 1975-09-04 | 1977-03-09 | Nikku Ind Co | Apparatus for continuous vacuum pressure application treatment of textile goods |
-
1980
- 1980-12-17 JP JP55178497A patent/JPS57102063A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933569A (en) * | 1972-07-26 | 1974-03-28 | ||
JPS521067U (en) * | 1976-06-18 | 1977-01-06 | ||
JPS5337459U (en) * | 1976-09-07 | 1978-04-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS6161705B2 (en) | 1986-12-26 |
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