JPS5689520A - Bonding method of metal plate - Google Patents
Bonding method of metal plateInfo
- Publication number
- JPS5689520A JPS5689520A JP16709079A JP16709079A JPS5689520A JP S5689520 A JPS5689520 A JP S5689520A JP 16709079 A JP16709079 A JP 16709079A JP 16709079 A JP16709079 A JP 16709079A JP S5689520 A JPS5689520 A JP S5689520A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- bonding
- bonded
- phenoxy resin
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000013034 phenoxy resin Substances 0.000 abstract 3
- 229920006287 phenoxy resin Polymers 0.000 abstract 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000007767 bonding agent Substances 0.000 abstract 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To improve the productivity with ease when the metal plate is bonded to a metal plate or another object, to increase the bonded strength and to heat-weld them at a low temperature within a short period, by using as an bonding agent a phenoxy resin film.
CONSTITUTION: When the metal plate is bonded to another metal plate or another object by heat and pressure bonding, as a bonding agent is used a phenoxy resin film [obtained by heating a phenoxy resin produced by polymerization (degree thereof is preferably about 100) of bisphenol A and epichlorohydrin to melt the resin, and forming it into a film by a T-die method or the like] having a thickness preferably more than 80μ. The following conditions are preferred; the pressure bonding temperature is between 110 and 160°C, the bonding pressure is between 0.2 and 6kg/cm2, and the pressure bonding time is between 0.5 and 6 seconds when they are preliminary heated or between 2 and 15 seconds when not.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709079A JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16709079A JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689520A true JPS5689520A (en) | 1981-07-20 |
| JPS6244589B2 JPS6244589B2 (en) | 1987-09-21 |
Family
ID=15843226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16709079A Granted JPS5689520A (en) | 1979-12-21 | 1979-12-21 | Bonding method of metal plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5689520A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106983A (en) * | 1980-01-30 | 1981-08-25 | Unitika Ltd | Bonding method of film |
| JPS59146837A (en) * | 1983-02-14 | 1984-08-22 | 日本鋼管株式会社 | Composite steel plate for damping vibration and manufacture thereof |
| CN110023541A (en) * | 2017-01-13 | 2019-07-16 | 旭化成株式会社 | The update method of electrode for electrolysis, electrolytic cell, electrode laminate and electrode |
| JPWO2022270613A1 (en) * | 2021-06-24 | 2022-12-29 | ||
| JPWO2023127667A1 (en) * | 2021-12-27 | 2023-07-06 | ||
| JPWO2023127668A1 (en) * | 2021-12-27 | 2023-07-06 | ||
| WO2023127666A1 (en) * | 2021-12-27 | 2023-07-06 | 株式会社レゾナック | Method for producing bonded body |
| WO2024135166A1 (en) * | 2022-12-23 | 2024-06-27 | 株式会社レゾナック | Laminate and laminate manufacturing method |
| WO2024143148A1 (en) * | 2022-12-26 | 2024-07-04 | 株式会社レゾナック | Method for producing film-like bonding material |
-
1979
- 1979-12-21 JP JP16709079A patent/JPS5689520A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106983A (en) * | 1980-01-30 | 1981-08-25 | Unitika Ltd | Bonding method of film |
| JPS59146837A (en) * | 1983-02-14 | 1984-08-22 | 日本鋼管株式会社 | Composite steel plate for damping vibration and manufacture thereof |
| CN110023541A (en) * | 2017-01-13 | 2019-07-16 | 旭化成株式会社 | The update method of electrode for electrolysis, electrolytic cell, electrode laminate and electrode |
| CN110023541B (en) * | 2017-01-13 | 2022-02-08 | 旭化成株式会社 | Electrode for electrolysis, electrolytic cell, electrode laminate, and method for renewing electrode |
| JPWO2022270613A1 (en) * | 2021-06-24 | 2022-12-29 | ||
| JPWO2023127667A1 (en) * | 2021-12-27 | 2023-07-06 | ||
| JPWO2023127668A1 (en) * | 2021-12-27 | 2023-07-06 | ||
| WO2023127666A1 (en) * | 2021-12-27 | 2023-07-06 | 株式会社レゾナック | Method for producing bonded body |
| WO2023127667A1 (en) * | 2021-12-27 | 2023-07-06 | 株式会社レゾナック | Method for manufacturing joined body |
| WO2024135166A1 (en) * | 2022-12-23 | 2024-06-27 | 株式会社レゾナック | Laminate and laminate manufacturing method |
| WO2024143148A1 (en) * | 2022-12-26 | 2024-07-04 | 株式会社レゾナック | Method for producing film-like bonding material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244589B2 (en) | 1987-09-21 |
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