JPS5688332A - Marking material for semiconductor element - Google Patents
Marking material for semiconductor elementInfo
- Publication number
- JPS5688332A JPS5688332A JP16556779A JP16556779A JPS5688332A JP S5688332 A JPS5688332 A JP S5688332A JP 16556779 A JP16556779 A JP 16556779A JP 16556779 A JP16556779 A JP 16556779A JP S5688332 A JPS5688332 A JP S5688332A
- Authority
- JP
- Japan
- Prior art keywords
- glycerin
- high temperature
- arabian
- paste
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 abstract 6
- 235000011187 glycerol Nutrition 0.000 abstract 3
- 239000006229 carbon black Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 241000872198 Serjania polyphylla Species 0.000 abstract 1
- 230000001066 destructive effect Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000012778 molding material Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To obtainn a strong a mark by baking at a high temperature for a short time by adding a molding material mainly containing epoxy and carbon black in an ink containing glycerin, Arabian paste and so forth. CONSTITUTION:The ink is prepared by mixing thermosetting plastic containing 95% of glycerin and 5% of carbon black with a mixture of 75% of Arabian paste and 30% of glycerin at a ratio of 1:1. According to this composition, it can shorten the drying time at a high temperature and can also bake and dry at a high temperature, thereby obtaining a mark being hardly destructive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16556779A JPS5688332A (en) | 1979-12-21 | 1979-12-21 | Marking material for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16556779A JPS5688332A (en) | 1979-12-21 | 1979-12-21 | Marking material for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5688332A true JPS5688332A (en) | 1981-07-17 |
Family
ID=15814809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16556779A Pending JPS5688332A (en) | 1979-12-21 | 1979-12-21 | Marking material for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5688332A (en) |
-
1979
- 1979-12-21 JP JP16556779A patent/JPS5688332A/en active Pending
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