JPS5681676A - Enameling method - Google Patents
Enameling methodInfo
- Publication number
- JPS5681676A JPS5681676A JP15745579A JP15745579A JPS5681676A JP S5681676 A JPS5681676 A JP S5681676A JP 15745579 A JP15745579 A JP 15745579A JP 15745579 A JP15745579 A JP 15745579A JP S5681676 A JPS5681676 A JP S5681676A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- stainless steel
- steel sheet
- copper plated
- plated layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004534 enameling Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 5
- 239000010949 copper Substances 0.000 abstract 5
- 210000003298 dental enamel Anatomy 0.000 abstract 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract 3
- 239000010935 stainless steel Substances 0.000 abstract 3
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Glass Compositions (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
PURPOSE: To facilitate enameling operation so as to manufacture enameled product of high quality, by bonding enamel layer to stainless steel sheet through copper plated layer.
CONSTITUTION: A substrate 1 made of stainless steel sheet is plated with copper 2 on the surface. The copper plated layer 2 is formed preferably by electroplating process in about 10μ thickness. A masking is made in order to form desired pattern on the surface of the copper plated layer 2, then enamel glaze 3 is applied and is baked. The glazing is performed preferably by physical means such as spraying, or dipping. After baking, copper plated layer on the part excepting that under the enamel layer 3 is removed by grinding. Hereby adhesion of enamel layer 3 to the stainless steel sheet 1 is improved, hence an enamelled product of high quality is manufactured.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15745579A JPS5681676A (en) | 1979-12-06 | 1979-12-06 | Enameling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15745579A JPS5681676A (en) | 1979-12-06 | 1979-12-06 | Enameling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5681676A true JPS5681676A (en) | 1981-07-03 |
Family
ID=15650026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15745579A Pending JPS5681676A (en) | 1979-12-06 | 1979-12-06 | Enameling method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5681676A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49117511A (en) * | 1973-03-15 | 1974-11-09 |
-
1979
- 1979-12-06 JP JP15745579A patent/JPS5681676A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49117511A (en) * | 1973-03-15 | 1974-11-09 |
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