JPS5672047A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS5672047A JPS5672047A JP14884679A JP14884679A JPS5672047A JP S5672047 A JPS5672047 A JP S5672047A JP 14884679 A JP14884679 A JP 14884679A JP 14884679 A JP14884679 A JP 14884679A JP S5672047 A JPS5672047 A JP S5672047A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- hardener
- filler
- oxalic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000012778 molding material Substances 0.000 title abstract 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 abstract 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 235000006408 oxalic acid Nutrition 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 150000003863 ammonium salts Chemical class 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 229910002026 crystalline silica Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To provide the titled molding compsn. which inhibits the corrosion of metallic electronic parts such as a sealed aluminum electrode, by a method wherein a small amount of oxalic acid (or a salt thereof) is added to an electronic part sealing compsn. consisting of an epoxy resin, a hardener and a filler.
CONSTITUTION: 100pts.wt. of a mixt. (A) consisting of an epoxy resin (i) and a hardener (ii) for the epoxy resin (e.g. a phenolic novolak), 150W400pts.wt. of an inorg. filler (B) (e.g. crystalline silica powder or silica glass powder) and at least 0.1pt.wt. of oxalic acid or an oxalate (C) (e.g. a metal salt such as Zn, Mn or Al or ammonium salt) are mixed together by means of a mixer and then melt- mixed by means of heating rollers, etc. to obtain the titled molding material.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14884679A JPS5672047A (en) | 1979-11-19 | 1979-11-19 | Epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14884679A JPS5672047A (en) | 1979-11-19 | 1979-11-19 | Epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5672047A true JPS5672047A (en) | 1981-06-16 |
Family
ID=15462038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14884679A Pending JPS5672047A (en) | 1979-11-19 | 1979-11-19 | Epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5672047A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57122549A (en) * | 1980-11-08 | 1982-07-30 | Plessey Overseas | Plastic sealed electronic equipment |
| JPS5815260A (en) * | 1981-07-21 | 1983-01-28 | Denki Kagaku Kogyo Kk | Sealing agent for semiconductor package |
| JPS5975921A (en) * | 1982-10-23 | 1984-04-28 | Denki Kagaku Kogyo Kk | Epoxy resin composition |
| JPH0352945A (en) * | 1989-07-20 | 1991-03-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JPH0359064A (en) * | 1989-07-28 | 1991-03-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JPH0359062A (en) * | 1989-07-28 | 1991-03-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JP2006137838A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Epoxy-based resin composition, epoxy resin-based adhesive composition, cover lay for flexible printed circuit board, copper-clad laminated board for flexible printed circuit board, the resultant flexible printed circuit board, prepreg, copper-clad laminated board, photosensitive dry film, photosensitive liquid resist, and printed wiring board |
-
1979
- 1979-11-19 JP JP14884679A patent/JPS5672047A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57122549A (en) * | 1980-11-08 | 1982-07-30 | Plessey Overseas | Plastic sealed electronic equipment |
| JPS5815260A (en) * | 1981-07-21 | 1983-01-28 | Denki Kagaku Kogyo Kk | Sealing agent for semiconductor package |
| JPS623983B2 (en) * | 1981-07-21 | 1987-01-28 | Denki Kagaku Kogyo Kk | |
| JPS5975921A (en) * | 1982-10-23 | 1984-04-28 | Denki Kagaku Kogyo Kk | Epoxy resin composition |
| JPH0352945A (en) * | 1989-07-20 | 1991-03-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JPH0359064A (en) * | 1989-07-28 | 1991-03-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JPH0359062A (en) * | 1989-07-28 | 1991-03-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition suitable for laser printing |
| JP2006137838A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Epoxy-based resin composition, epoxy resin-based adhesive composition, cover lay for flexible printed circuit board, copper-clad laminated board for flexible printed circuit board, the resultant flexible printed circuit board, prepreg, copper-clad laminated board, photosensitive dry film, photosensitive liquid resist, and printed wiring board |
| JP4707998B2 (en) * | 2004-11-11 | 2011-06-22 | 株式会社フジクラ | Epoxy resin adhesive composition for flexible printed circuit board, coverlay for flexible printed circuit board, copper-clad laminate for flexible printed circuit board, and flexible printed circuit board |
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