JPS5667976A - Preparation method of light potentiometer element - Google Patents
Preparation method of light potentiometer elementInfo
- Publication number
- JPS5667976A JPS5667976A JP14404379A JP14404379A JPS5667976A JP S5667976 A JPS5667976 A JP S5667976A JP 14404379 A JP14404379 A JP 14404379A JP 14404379 A JP14404379 A JP 14404379A JP S5667976 A JPS5667976 A JP S5667976A
- Authority
- JP
- Japan
- Prior art keywords
- light
- pin hole
- light conduction
- conduction film
- potentiometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/205—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive semiconductor devices have no potential barriers, e.g. photoresistors
- H10F55/208—Optical potentiometers
Landscapes
- Adjustable Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Transform (AREA)
Abstract
PURPOSE:To improve an operational efficiency in the preparation process of a light potentiometer by a method wherein a pattern shape of a light conduction films at the terminal part of a light potentiometer is regulated so as no to produce cracks by means of a coating of an electrode. CONSTITUTION:A light conduction film is installed round a pin hole 8a intermittently. In other words, in a terminal part area 8 centered around the pin hole 8a, light conduction film forming areas PF1, PF2 are adjacent to substrate surface exposing areas PN1, PN2. An electrode 5 is formed in such a way as to coat a terminal 8 wherein a light conduction film of a pattern like this is formed. And when a lead wire for connecting a power source and a potentiometer is inserted into the pin hole 8a of the terminal part 8 and is fixed with soldering, a solder in a melting state flows from the vicinity of the pin hole into a peripheral area and it fills a cracked part produced at the brim part of the light conduction film forming area PF1, PF2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54144043A JPS6057236B2 (en) | 1979-11-07 | 1979-11-07 | Manufacturing method of optical potentiometer element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54144043A JPS6057236B2 (en) | 1979-11-07 | 1979-11-07 | Manufacturing method of optical potentiometer element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5667976A true JPS5667976A (en) | 1981-06-08 |
JPS6057236B2 JPS6057236B2 (en) | 1985-12-13 |
Family
ID=15352984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54144043A Expired JPS6057236B2 (en) | 1979-11-07 | 1979-11-07 | Manufacturing method of optical potentiometer element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6057236B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114709091A (en) * | 2022-04-29 | 2022-07-05 | 南通原声电子有限公司 | Returning and sleeving equipment for processing electrolytic capacitor |
-
1979
- 1979-11-07 JP JP54144043A patent/JPS6057236B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114709091A (en) * | 2022-04-29 | 2022-07-05 | 南通原声电子有限公司 | Returning and sleeving equipment for processing electrolytic capacitor |
CN114709091B (en) * | 2022-04-29 | 2022-12-16 | 南通原声电子有限公司 | Returning and sleeving equipment for processing electrolytic capacitor |
Also Published As
Publication number | Publication date |
---|---|
JPS6057236B2 (en) | 1985-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES474830A1 (en) | Tinned copper braid for solder removing and method of manufacturing the same. | |
JPS5513933A (en) | Circuit element substrate and its manufacturing method | |
JPS5667976A (en) | Preparation method of light potentiometer element | |
DE3272610D1 (en) | Method of soldering zinc oxide varistors | |
JPS57140879A (en) | Production of long life insoluble electrode | |
JPS55138864A (en) | Method of fabricating semiconductor assembling substrate | |
GB1474247A (en) | Provision of solder-stop protection for conductor paths on circuit boards | |
JPS55156339A (en) | Forming method of bump electrode | |
JPS5739190A (en) | Preparation of solder plated or tin plated wire | |
JPS5219297A (en) | Method of manufacturing a metal film resistor | |
SU1234088A1 (en) | Method of manufacturing article from closed wire links | |
JPS56130920A (en) | Forming method of electrode for semiconductor device | |
JPS56151165A (en) | Soldering method | |
JPS54140871A (en) | Manufacture of semiconductor device | |
JPS56147464A (en) | Forming method for soldering terminal portion of thin film element | |
JPS531468A (en) | Formation of semiconductor electrode | |
JPS5772358A (en) | Lead frame and its manufacture | |
JPS555173A (en) | Brazing method by nickel-phosphorus alloy | |
JPS5684912A (en) | Manufacture of holl0w cylindrical assembled body | |
JPS544067A (en) | Electrode forming method of semiconductor device | |
JPS55141536A (en) | Manufacture of compound superconductor | |
JPS539840A (en) | Varnish coating method | |
JPS5469967A (en) | Production of semiconductor device | |
JPS55103273A (en) | Soldered structural body of two members and production thereof | |
JPS56100455A (en) | Manufacture of semiconductor device |