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JPS5665023A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5665023A
JPS5665023A JP14074879A JP14074879A JPS5665023A JP S5665023 A JPS5665023 A JP S5665023A JP 14074879 A JP14074879 A JP 14074879A JP 14074879 A JP14074879 A JP 14074879A JP S5665023 A JPS5665023 A JP S5665023A
Authority
JP
Japan
Prior art keywords
groups
formula
compound
organic residue
double bonds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14074879A
Other languages
Japanese (ja)
Other versions
JPS6342659B2 (en
Inventor
Akio Nishihara
Hiroshi Tsuchiya
Jinichi Omi
Yoshikazu Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP14074879A priority Critical patent/JPS5665023A/en
Publication of JPS5665023A publication Critical patent/JPS5665023A/en
Publication of JPS6342659B2 publication Critical patent/JPS6342659B2/ja
Granted legal-status Critical Current

Links

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  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

PURPOSE: Titled composition which has excellent curability and provides cured products having excellent mechanical strength, elongation, flexibility, etc., comprising a polythiol compound and a specified polyene compound.
CONSTITUTION: (a) A polythiol compound of the formula I, wherein A is a q- valent organic residue free from unsaturated bonds reactive with SH groups and q≥2, is mixed with (b) a polyene compound having, in the molecule, at least two C-C double bonds, represented by formula II, wherein R is H, phenyl or a 1W10C alkyl, Y is a group consisting of a homogeneous, blocked or random arrangement of groups derived by ring opening by the cleavage of the C-O bond of the epoxy group of epoxy compounds such as ethylene oxide and epihalohydrins, A is an (m+n)- valent organic residue which can contain O, N, S or a halogen and which combines with other groups via an ester linkage or an ether linkage, k is 1W10, m is 1W6, n is 0W5 and m+n≥2, so that the eq. ratio of the C-C double bonds to the thiol groups is 0.70W1.5/1.
COPYRIGHT: (C)1981,JPO&Japio
JP14074879A 1979-10-31 1979-10-31 Curable resin composition Granted JPS5665023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14074879A JPS5665023A (en) 1979-10-31 1979-10-31 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14074879A JPS5665023A (en) 1979-10-31 1979-10-31 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS5665023A true JPS5665023A (en) 1981-06-02
JPS6342659B2 JPS6342659B2 (en) 1988-08-24

Family

ID=15275808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14074879A Granted JPS5665023A (en) 1979-10-31 1979-10-31 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5665023A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375035A (en) * 1986-09-19 1988-04-05 Denki Kagaku Kogyo Kk Photo-curing composition
JPH0232157A (en) * 1988-07-20 1990-02-01 Denki Kagaku Kogyo Kk Photo-setting composition and laminate using said composition as adhesive layer
CN110719928A (en) * 2017-06-09 2020-01-21 Prc-迪索托国际公司 Dual cure sealant

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03111365A (en) * 1989-09-21 1991-05-13 Toyo Ink Mfg Co Ltd Core for recording material and its sensing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492285A (en) * 1972-04-26 1974-01-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492285A (en) * 1972-04-26 1974-01-10

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375035A (en) * 1986-09-19 1988-04-05 Denki Kagaku Kogyo Kk Photo-curing composition
JPH0232157A (en) * 1988-07-20 1990-02-01 Denki Kagaku Kogyo Kk Photo-setting composition and laminate using said composition as adhesive layer
CN110719928A (en) * 2017-06-09 2020-01-21 Prc-迪索托国际公司 Dual cure sealant
JP2020523443A (en) * 2017-06-09 2020-08-06 ピーアールシー−デソト インターナショナル，インコーポレイティド Double cure sealant
CN110719928B (en) * 2017-06-09 2022-08-12 Prc-迪索托国际公司 Dual cure sealant
US11655340B2 (en) 2017-06-09 2023-05-23 Prc-Desoto International, Inc. Dual cure sealants

Also Published As

Publication number Publication date
JPS6342659B2 (en) 1988-08-24

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