JPS5664825A - Dielectric adhering method of flash panel - Google Patents
Dielectric adhering method of flash panelInfo
- Publication number
- JPS5664825A JPS5664825A JP13843879A JP13843879A JPS5664825A JP S5664825 A JPS5664825 A JP S5664825A JP 13843879 A JP13843879 A JP 13843879A JP 13843879 A JP13843879 A JP 13843879A JP S5664825 A JPS5664825 A JP S5664825A
- Authority
- JP
- Japan
- Prior art keywords
- flash panel
- frame material
- plate materials
- panel
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 6
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To reduce the energy loss by a method wherein a nonelectric-conductive mask is contacted with an upper and a lower surfaces of the flash panel formed by interposing a frame material having both surfaces coated with a thermosetting resin adhesive by plate materials and high frequency high voltage is applied thereto to heat a part to be adhered efficiently.
CONSTITUTION: The thermosettig resin adhesive 2 is coated on both surfaces of the wooder frame material 1 and the plate materials 3 are adhered to the both surface thereof to for the flash panel 4. This flash panel 4 is positioned between an upper and a lower electrodes 6 and a part of the thermosetting adhesive 2 is heated and cured by the high frequency dielectric heating. Between the panel 4 and the electrodes, the nonelectric-conductive mask 5 having a shape same to that of a framework of the frame material 1 is interposed. The heat deterioration of the plate materials is not generated and the energy loss is eliminated from a standpoint of heat efficiency.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13843879A JPS5664825A (en) | 1979-10-25 | 1979-10-25 | Dielectric adhering method of flash panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13843879A JPS5664825A (en) | 1979-10-25 | 1979-10-25 | Dielectric adhering method of flash panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5664825A true JPS5664825A (en) | 1981-06-02 |
| JPS6120414B2 JPS6120414B2 (en) | 1986-05-22 |
Family
ID=15221979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13843879A Granted JPS5664825A (en) | 1979-10-25 | 1979-10-25 | Dielectric adhering method of flash panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5664825A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023454A (en) * | 2008-07-24 | 2010-02-04 | Panasonic Electric Works Co Ltd | Adhesion method between face material and bar material and adhesion device for the same |
-
1979
- 1979-10-25 JP JP13843879A patent/JPS5664825A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010023454A (en) * | 2008-07-24 | 2010-02-04 | Panasonic Electric Works Co Ltd | Adhesion method between face material and bar material and adhesion device for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120414B2 (en) | 1986-05-22 |
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