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JPS5659847A - Production of laminated board - Google Patents

Production of laminated board

Info

Publication number
JPS5659847A
JPS5659847A JP13571379A JP13571379A JPS5659847A JP S5659847 A JPS5659847 A JP S5659847A JP 13571379 A JP13571379 A JP 13571379A JP 13571379 A JP13571379 A JP 13571379A JP S5659847 A JPS5659847 A JP S5659847A
Authority
JP
Japan
Prior art keywords
laminated board
impregnated
resin
glass cloth
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13571379A
Other languages
Japanese (ja)
Inventor
Takeshi Ishikawa
Kazuhiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP13571379A priority Critical patent/JPS5659847A/en
Publication of JPS5659847A publication Critical patent/JPS5659847A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE: To obtain a laminated board having high dimensional stability, and enhanced electrical insulation resistance and bending strength, by the heat-pressure molding of a laminated product, produced by the impregnation of a γ-aminopropyltriethoxysilane-adhered glass cloth with a resin for a laminated board, followed by drying.
CONSTITUTION: A glass cloth composed of a glass fiber is impregnated with a solution of γ-aminopropylethoxy-silane and dryed, to obtain an impregnated glass cloth containing 0.01W2.5wt% of the above component. Then said impregnated glass cloth is impregnated with a resin for a laminated board, composed of a thermosetting resin such as an epoxy resin or a phenol resin, and dryed, to obtain a prepreg. A laminated board having high dimensional stability, and enhanced electrical insulation resistance and bending strength, is obtained by the heat-pressure molding of a laminated product produced by laminating the required number of said prepregs.
COPYRIGHT: (C)1981,JPO&Japio
JP13571379A 1979-10-19 1979-10-19 Production of laminated board Pending JPS5659847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13571379A JPS5659847A (en) 1979-10-19 1979-10-19 Production of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13571379A JPS5659847A (en) 1979-10-19 1979-10-19 Production of laminated board

Publications (1)

Publication Number Publication Date
JPS5659847A true JPS5659847A (en) 1981-05-23

Family

ID=15158136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13571379A Pending JPS5659847A (en) 1979-10-19 1979-10-19 Production of laminated board

Country Status (1)

Country Link
JP (1) JPS5659847A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015171767A (en) * 2014-03-11 2015-10-01 信越化学工業株式会社 Metal-clad composite laminated substrate, and semiconductor device
US10743412B2 (en) 2014-02-27 2020-08-11 Shin-Etsu Chemical Co., Ltd. Substrate and semiconductor apparatus
WO2021157442A1 (en) * 2020-02-03 2021-08-12 東レ株式会社 Molding material and fiber reinforced composite material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10743412B2 (en) 2014-02-27 2020-08-11 Shin-Etsu Chemical Co., Ltd. Substrate and semiconductor apparatus
JP2015171767A (en) * 2014-03-11 2015-10-01 信越化学工業株式会社 Metal-clad composite laminated substrate, and semiconductor device
WO2021157442A1 (en) * 2020-02-03 2021-08-12 東レ株式会社 Molding material and fiber reinforced composite material

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