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JPS5650934A - Heat-resistant prepreg - Google Patents

Heat-resistant prepreg

Info

Publication number
JPS5650934A
JPS5650934A JP12812679A JP12812679A JPS5650934A JP S5650934 A JPS5650934 A JP S5650934A JP 12812679 A JP12812679 A JP 12812679A JP 12812679 A JP12812679 A JP 12812679A JP S5650934 A JPS5650934 A JP S5650934A
Authority
JP
Japan
Prior art keywords
prepolymer
imide
epoxy resin
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12812679A
Other languages
Japanese (ja)
Other versions
JPS6235410B2 (en
Inventor
Shohei Eto
Norimoto Moriwaki
Akira Fukami
Hiroyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12812679A priority Critical patent/JPS5650934A/en
Publication of JPS5650934A publication Critical patent/JPS5650934A/en
Publication of JPS6235410B2 publication Critical patent/JPS6235410B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare a highly flexible, tough, heat-resistant prepreg, by a method wherein a specific imide-epoxy resin is reacted with a diamine to obtain a prepolymer, and a base material is impregnated with a composition of the prepolymer and a thermoplastic polymer and dried.
CONSTITUTION: An imide ring-contg. dicarboxylic compd. represented by formula I (R: aromatic or aliphatic diamino residue), such as one represented by formula II or III, is mixed with a polyfunctional epoxy resin so that its carboxyl group and epoxy group is in a ratio of about 1:1.6W50 (equivalent ratio). The mixture is polymerized to provide an imide epoxy resin (a), to which a diamine (b) is added in about 0.5W1.5 active hydrogen equivalent per equivalent of epoxy end group. Then, both are reacted together to provide a prepolymer (A). 100pts. of the prepolymer (A) and about 1W20pts. of a thermoplastic resin (e.g. phenoxy resin) (B) are compounded and dissolved in an organic solvent, and the solution is coated on a base material and is dried to provide a prepreg.
COPYRIGHT: (C)1981,JPO&Japio
JP12812679A 1979-10-04 1979-10-04 Heat-resistant prepreg Granted JPS5650934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12812679A JPS5650934A (en) 1979-10-04 1979-10-04 Heat-resistant prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12812679A JPS5650934A (en) 1979-10-04 1979-10-04 Heat-resistant prepreg

Publications (2)

Publication Number Publication Date
JPS5650934A true JPS5650934A (en) 1981-05-08
JPS6235410B2 JPS6235410B2 (en) 1987-08-01

Family

ID=14977030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12812679A Granted JPS5650934A (en) 1979-10-04 1979-10-04 Heat-resistant prepreg

Country Status (1)

Country Link
JP (1) JPS5650934A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196138A (en) * 1984-03-15 1985-10-04 林　君夫 Production of doughnut
JPH01103632A (en) * 1987-07-06 1989-04-20 Matsushita Electric Works Ltd Electrical insulating laminated plate and sealing material for electronic component
JPH01113440A (en) * 1987-07-06 1989-05-02 Matsushita Electric Works Ltd Laminated plate for electrical insulation and sealing material for electrical part
JPH05114501A (en) * 1988-05-26 1993-05-07 Matsushita Electric Works Ltd Material for sealing electronic parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124597A (en) * 1977-04-06 1978-10-31 Toshiba Chem Corp Heat-resistant polyimide resin

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124597A (en) * 1977-04-06 1978-10-31 Toshiba Chem Corp Heat-resistant polyimide resin

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196138A (en) * 1984-03-15 1985-10-04 林　君夫 Production of doughnut
JPS625569B2 (en) * 1984-03-15 1987-02-05 Kimio Hayashi
JPH01103632A (en) * 1987-07-06 1989-04-20 Matsushita Electric Works Ltd Electrical insulating laminated plate and sealing material for electronic component
JPH01113440A (en) * 1987-07-06 1989-05-02 Matsushita Electric Works Ltd Laminated plate for electrical insulation and sealing material for electrical part
JPH0588892B2 (en) * 1987-07-06 1993-12-24 Matsushita Electric Works Ltd
JPH05114501A (en) * 1988-05-26 1993-05-07 Matsushita Electric Works Ltd Material for sealing electronic parts

Also Published As

Publication number Publication date
JPS6235410B2 (en) 1987-08-01

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