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JPS5650523A - Power semiconductor device - Google Patents

Power semiconductor device

Info

Publication number
JPS5650523A
JPS5650523A JP12753179A JP12753179A JPS5650523A JP S5650523 A JPS5650523 A JP S5650523A JP 12753179 A JP12753179 A JP 12753179A JP 12753179 A JP12753179 A JP 12753179A JP S5650523 A JPS5650523 A JP S5650523A
Authority
JP
Japan
Prior art keywords
inserting plate
metal inserting
rubber
semiconductor element
adhesion strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12753179A
Other languages
Japanese (ja)
Inventor
Kiyohiko Mihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12753179A priority Critical patent/JPS5650523A/en
Publication of JPS5650523A publication Critical patent/JPS5650523A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To increase an adhesion strength of a metal inserting plate and a semiconductor element and to eliminate dislocation or deviation of patterning by a method wherein the metal inserting plate, to be used for leading out a current from a cathode electrode of a semiconductor elements, is formed into a cap shape. CONSTITUTION:A cap-shaped metal inserting plate 13, having almost same pattern as a cathode electode 3 of a semiconductor element 30 and consiting of molybdenum with an almost equal thermal expansion coefficient as a silicon wafer 2, is adhered to a semiconductor elements 30 using a sticking rubber 12 and a protruding section 13a of the metal inserting plate 13. Accordingly a place, where the protruding section 13a and the semiconductor element 30 are thoroughly adhered with the sticking rubber 12, is provided and the adhesion strength is increased. Also, as the protrusion 13a stops the sticking rubber to come out, running out of said rubber to the surface of the metal inserting plate 13 is prevented and removal of run-out rubber after vul canization becomes unnecessary.
JP12753179A 1979-10-01 1979-10-01 Power semiconductor device Pending JPS5650523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12753179A JPS5650523A (en) 1979-10-01 1979-10-01 Power semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12753179A JPS5650523A (en) 1979-10-01 1979-10-01 Power semiconductor device

Publications (1)

Publication Number Publication Date
JPS5650523A true JPS5650523A (en) 1981-05-07

Family

ID=14962316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12753179A Pending JPS5650523A (en) 1979-10-01 1979-10-01 Power semiconductor device

Country Status (1)

Country Link
JP (1) JPS5650523A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151814A (en) * 1983-02-15 1984-08-30 凸版印刷株式会社 Growing of mushroom
JPS6024119A (en) * 1983-07-20 1985-02-06 凸版印刷株式会社 Mushroom germinating method
JPS6087534U (en) * 1983-11-22 1985-06-15 凸版印刷株式会社 growth paper
US6597182B1 (en) * 1999-05-07 2003-07-22 Nec Electronics Corporation Detector for detecting contact resistance anomaly of cathode electrode in electroplating machine
US11266362B2 (en) 2019-06-13 2022-03-08 Canon Medical Systems Corporation X-ray detection unit for wheelchair, and X-ray diagnostic apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151814A (en) * 1983-02-15 1984-08-30 凸版印刷株式会社 Growing of mushroom
JPS6024119A (en) * 1983-07-20 1985-02-06 凸版印刷株式会社 Mushroom germinating method
JPH0135611B2 (en) * 1983-07-20 1989-07-26 Toppan Printing Co Ltd
JPS6087534U (en) * 1983-11-22 1985-06-15 凸版印刷株式会社 growth paper
JPH0210915Y2 (en) * 1983-11-22 1990-03-19
US6597182B1 (en) * 1999-05-07 2003-07-22 Nec Electronics Corporation Detector for detecting contact resistance anomaly of cathode electrode in electroplating machine
US11266362B2 (en) 2019-06-13 2022-03-08 Canon Medical Systems Corporation X-ray detection unit for wheelchair, and X-ray diagnostic apparatus

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