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JPS5649208A - Molding die - Google Patents

Molding die

Info

Publication number
JPS5649208A
JPS5649208A JP12411379A JP12411379A JPS5649208A JP S5649208 A JPS5649208 A JP S5649208A JP 12411379 A JP12411379 A JP 12411379A JP 12411379 A JP12411379 A JP 12411379A JP S5649208 A JPS5649208 A JP S5649208A
Authority
JP
Japan
Prior art keywords
cavities
products
runners
resin
cavity arranged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12411379A
Other languages
Japanese (ja)
Inventor
Hidetoshi Mochizuki
Keizo Otsuki
Akira Suzuki
Kunihiro Tsubosaki
Yutaka Iwata
Sakae Kikuchi
Akiro Hoshi
Hiroshi Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12411379A priority Critical patent/JPS5649208A/en
Publication of JPS5649208A publication Critical patent/JPS5649208A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To relieve the extraordinary bending force acting on the members within the cavities by providing dummy cavities at the runner parts of the cavity arranging parts for the products, in molding semiconductors and the like. CONSTITUTION:In cavity arranged parts 2 for the products of a molding die 1, a liquefied molding resin is injected through runners 3 in a large number of cavities provided in parallel in one-line shape at both sides of each of the runners 3. In the thus molded runners 3 there are provided dummy cavities 4 in the vicinity of the cavity arranged part 2 for the products. Accordingly, upon injection of the resin, a part of the resin is branched to the dummy cavities 4, whereby the extraordinary bending force acting on the members within the respective cavities in the cavity arranged part 2 for the products can be relieved, and voids introduced in the products can be largely decreased.
JP12411379A 1979-09-28 1979-09-28 Molding die Pending JPS5649208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12411379A JPS5649208A (en) 1979-09-28 1979-09-28 Molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12411379A JPS5649208A (en) 1979-09-28 1979-09-28 Molding die

Publications (1)

Publication Number Publication Date
JPS5649208A true JPS5649208A (en) 1981-05-02

Family

ID=14877237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12411379A Pending JPS5649208A (en) 1979-09-28 1979-09-28 Molding die

Country Status (1)

Country Link
JP (1) JPS5649208A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154217A (en) * 1979-05-09 1980-12-01 Gadelius Kk Method of bundling steel bars of rectangular cross section by bundler
JPS58210628A (en) * 1982-05-31 1983-12-07 Toshiba Corp Molding for sealing semiconductor resin
JPS61167514A (en) * 1984-12-28 1986-07-29 Fujitsu Ltd Transfer mold
JPS6423909A (en) * 1987-07-20 1989-01-26 Takigawa Kogyo Kk Automatic binding apparatus
US7247267B2 (en) * 2003-08-12 2007-07-24 Advanced Semiconductor Engineering, Inc. Mold and method of molding semiconductor devices
JP2008055429A (en) * 2006-08-29 2008-03-13 Komatsu Ltd Casting mold and manufacturing method therefor
JP2009196230A (en) * 2008-02-22 2009-09-03 Denso Corp Manufacturing method for mold package, and molding die
WO2018123934A1 (en) * 2016-12-28 2018-07-05 東洋紡株式会社 Resin molded article and method for producing resin molded article

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Mold for transfer molding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Mold for transfer molding

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154217A (en) * 1979-05-09 1980-12-01 Gadelius Kk Method of bundling steel bars of rectangular cross section by bundler
JPS58210628A (en) * 1982-05-31 1983-12-07 Toshiba Corp Molding for sealing semiconductor resin
JPS61167514A (en) * 1984-12-28 1986-07-29 Fujitsu Ltd Transfer mold
JPH0124613B2 (en) * 1984-12-28 1989-05-12 Fujitsu Ltd
JPS6423909A (en) * 1987-07-20 1989-01-26 Takigawa Kogyo Kk Automatic binding apparatus
JPH0436929B2 (en) * 1987-07-20 1992-06-17 Takigawa Kogyo Kk
US7247267B2 (en) * 2003-08-12 2007-07-24 Advanced Semiconductor Engineering, Inc. Mold and method of molding semiconductor devices
JP2008055429A (en) * 2006-08-29 2008-03-13 Komatsu Ltd Casting mold and manufacturing method therefor
JP2009196230A (en) * 2008-02-22 2009-09-03 Denso Corp Manufacturing method for mold package, and molding die
WO2018123934A1 (en) * 2016-12-28 2018-07-05 東洋紡株式会社 Resin molded article and method for producing resin molded article
JPWO2018123934A1 (en) * 2016-12-28 2019-06-27 東洋紡株式会社 Resin molded product, and method for producing resin molded product
CN110121403A (en) * 2016-12-28 2019-08-13 东洋纺株式会社 The manufacturing method of resin forming article and resin forming article
US11014277B2 (en) 2016-12-28 2021-05-25 Toyobo Co., Ltd. Resin molded article and method for producing resin molded article

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