JPS5648623U - - Google Patents
Info
- Publication number
- JPS5648623U JPS5648623U JP12928179U JP12928179U JPS5648623U JP S5648623 U JPS5648623 U JP S5648623U JP 12928179 U JP12928179 U JP 12928179U JP 12928179 U JP12928179 U JP 12928179U JP S5648623 U JPS5648623 U JP S5648623U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Wrappers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12928179U JPS5648623U (en) | 1979-09-18 | 1979-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12928179U JPS5648623U (en) | 1979-09-18 | 1979-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5648623U true JPS5648623U (en) | 1981-04-30 |
Family
ID=29361060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12928179U Pending JPS5648623U (en) | 1979-09-18 | 1979-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648623U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230110337A (en) | 2020-12-24 | 2023-07-21 | 가부시키가이샤 사무코 | Method for polishing carrier plate, method for polishing carrier plate and semiconductor wafer |
-
1979
- 1979-09-18 JP JP12928179U patent/JPS5648623U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230110337A (en) | 2020-12-24 | 2023-07-21 | 가부시키가이샤 사무코 | Method for polishing carrier plate, method for polishing carrier plate and semiconductor wafer |