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JPS5646716A - Mold for thermosetting synthetic resin-molding - Google Patents

Mold for thermosetting synthetic resin-molding

Info

Publication number
JPS5646716A
JPS5646716A JP12281879A JP12281879A JPS5646716A JP S5646716 A JPS5646716 A JP S5646716A JP 12281879 A JP12281879 A JP 12281879A JP 12281879 A JP12281879 A JP 12281879A JP S5646716 A JPS5646716 A JP S5646716A
Authority
JP
Japan
Prior art keywords
cavity
resin
thermosetting resin
mold
fed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12281879A
Other languages
Japanese (ja)
Other versions
JPS6234530B2 (en
Inventor
Tamio Takeda
Yasuyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12281879A priority Critical patent/JPS5646716A/en
Publication of JPS5646716A publication Critical patent/JPS5646716A/en
Publication of JPS6234530B2 publication Critical patent/JPS6234530B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To provide a mold free of the production of air bubbles in thermosetting resin and reduction in insulation or the like, by a method wherein a vacuum suction is performed by providing a resin gathering cavity, which is connected to a cavity, in a location being positioned opposite to that of a resin pouring hole. CONSTITUTION:An object 4 to be molded is previously supported in a hollow of a cavity 17 by means of a core 5, and the inside of the cavity 17 is brought into a vacuum state. Compressed air is then fed into a raw material tank 6, and a liquid thermosetting resin 7, whose air is let out, is fed by pressure into the cavity 17 with valves 10 and 12 opened. The cavity is fully filled with the resin for a short period of time without the production of air bubbles due to the vacuum state in the cavity 17. The thermosetting resin 7, wherewith the cavity 7 is fully filled, flows into a resin gathering cavity 20. The thermosetting resin 7 is gelled by heating by means of a heater 25 thereupon. A pouring head valve 12 is closed, a vacuum pump 23 is detached, a mold 16 is unlocked, and a molded product is then unloaded.
JP12281879A 1979-09-25 1979-09-25 Mold for thermosetting synthetic resin-molding Granted JPS5646716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12281879A JPS5646716A (en) 1979-09-25 1979-09-25 Mold for thermosetting synthetic resin-molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12281879A JPS5646716A (en) 1979-09-25 1979-09-25 Mold for thermosetting synthetic resin-molding

Publications (2)

Publication Number Publication Date
JPS5646716A true JPS5646716A (en) 1981-04-28
JPS6234530B2 JPS6234530B2 (en) 1987-07-28

Family

ID=14845388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12281879A Granted JPS5646716A (en) 1979-09-25 1979-09-25 Mold for thermosetting synthetic resin-molding

Country Status (1)

Country Link
JP (1) JPS5646716A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775435A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Liquid transfer molding
JPS6248518A (en) * 1985-08-27 1987-03-03 Matsushita Electric Works Ltd Manufacture of sheet material for print wiring

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015030A (en) * 1973-05-03 1975-02-17
JPS52128670U (en) * 1976-03-26 1977-09-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015030A (en) * 1973-05-03 1975-02-17
JPS52128670U (en) * 1976-03-26 1977-09-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775435A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Liquid transfer molding
JPS6248518A (en) * 1985-08-27 1987-03-03 Matsushita Electric Works Ltd Manufacture of sheet material for print wiring

Also Published As

Publication number Publication date
JPS6234530B2 (en) 1987-07-28

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