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JPS5633848A - Manufacturing equipment for semiconductor device - Google Patents

Manufacturing equipment for semiconductor device

Info

Publication number
JPS5633848A
JPS5633848A JP10996479A JP10996479A JPS5633848A JP S5633848 A JPS5633848 A JP S5633848A JP 10996479 A JP10996479 A JP 10996479A JP 10996479 A JP10996479 A JP 10996479A JP S5633848 A JPS5633848 A JP S5633848A
Authority
JP
Japan
Prior art keywords
bonding
detector
semiconductor device
manufacturing equipment
bonding arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10996479A
Other languages
Japanese (ja)
Inventor
Joji Kosho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10996479A priority Critical patent/JPS5633848A/en
Publication of JPS5633848A publication Critical patent/JPS5633848A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the efficiency of work for the connection of semiconductor internal components and the quality of products by providing a control means moving a bonding arm to a predetermined side up and down in a nearly vertical direction. CONSTITUTION:A bonding arm 2 is moved up and down by a motor 11, a screw 9 and a detector 12 for rotary angle. Furthermore, a detector 10 for up and down movement is provided at one end of the bonding arm 2. And the positions that a bonding tool 3 is touched the bonding surface of a semiconductor device 7B and that of a semiconductor element 7A respectively are detected by utilizing the detector 10 for up and down movement. And necessary sinkage is set for each pin by the detection points (Said bonding surfaces).
JP10996479A 1979-08-28 1979-08-28 Manufacturing equipment for semiconductor device Pending JPS5633848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10996479A JPS5633848A (en) 1979-08-28 1979-08-28 Manufacturing equipment for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10996479A JPS5633848A (en) 1979-08-28 1979-08-28 Manufacturing equipment for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5633848A true JPS5633848A (en) 1981-04-04

Family

ID=14523604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10996479A Pending JPS5633848A (en) 1979-08-28 1979-08-28 Manufacturing equipment for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5633848A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014900A (en) * 1990-03-08 1991-05-14 Texas Instruments Incorporated Deep access bond head
JP2006319281A (en) * 2005-05-16 2006-11-24 Sony Corp Arm driving mechanism, packaging apparatus, method for driving arm, and method for packaging

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm
JPS5250055B2 (en) * 1974-09-25 1977-12-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250055B2 (en) * 1974-09-25 1977-12-21
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014900A (en) * 1990-03-08 1991-05-14 Texas Instruments Incorporated Deep access bond head
JP2006319281A (en) * 2005-05-16 2006-11-24 Sony Corp Arm driving mechanism, packaging apparatus, method for driving arm, and method for packaging

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