JPS56297A - Surface treatment of wire material - Google Patents
Surface treatment of wire materialInfo
- Publication number
- JPS56297A JPS56297A JP7546179A JP7546179A JPS56297A JP S56297 A JPS56297 A JP S56297A JP 7546179 A JP7546179 A JP 7546179A JP 7546179 A JP7546179 A JP 7546179A JP S56297 A JPS56297 A JP S56297A
- Authority
- JP
- Japan
- Prior art keywords
- wire material
- layer
- nickel
- copper
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract 5
- 238000004381 surface treatment Methods 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 9
- 229910052759 nickel Inorganic materials 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To remove magnetic properties due to Ni component by using heat treatment to mutually diffuse nickel layer and copper layer on the surface of stainless steel material.
CONSTITUTION: The process is a surface treatment of a stainless wire material. Nickel electroplating is applied around the wire material to form a one micron or less nickel layer. Then copper electroplating is applied, for which the thickness of the plated layer needs to be 20 microns or more. The entire body is heated at 700W 800°C to effect mutual diffusion of nickel and copper layers plated on the wire material, so that completely uniform alloy layer is obtained.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7546179A JPS56297A (en) | 1979-06-15 | 1979-06-15 | Surface treatment of wire material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7546179A JPS56297A (en) | 1979-06-15 | 1979-06-15 | Surface treatment of wire material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56297A true JPS56297A (en) | 1981-01-06 |
Family
ID=13576954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7546179A Pending JPS56297A (en) | 1979-06-15 | 1979-06-15 | Surface treatment of wire material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56297A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4860260A (en) * | 1986-06-12 | 1989-08-22 | Kabushiki Kaisha Toshiba | Semiconductor memory device with testing of redundant memory cells |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518389A (en) * | 1974-07-10 | 1976-01-23 | Mitsui Petrochemical Ind | Sekisobanno seizohoho |
-
1979
- 1979-06-15 JP JP7546179A patent/JPS56297A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518389A (en) * | 1974-07-10 | 1976-01-23 | Mitsui Petrochemical Ind | Sekisobanno seizohoho |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4860260A (en) * | 1986-06-12 | 1989-08-22 | Kabushiki Kaisha Toshiba | Semiconductor memory device with testing of redundant memory cells |
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