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JPS5626916A - Polymerizable composition - Google Patents

Polymerizable composition

Info

Publication number
JPS5626916A
JPS5626916A JP10182279A JP10182279A JPS5626916A JP S5626916 A JPS5626916 A JP S5626916A JP 10182279 A JP10182279 A JP 10182279A JP 10182279 A JP10182279 A JP 10182279A JP S5626916 A JPS5626916 A JP S5626916A
Authority
JP
Japan
Prior art keywords
alkylene
formula
alkyl
polymerizable composition
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10182279A
Other languages
Japanese (ja)
Inventor
Akira Yamamoto
Shuji Nishimura
Akihiro Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP10182279A priority Critical patent/JPS5626916A/en
Publication of JPS5626916A publication Critical patent/JPS5626916A/en
Pending legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: A polymerizable composition capable of forming a flexible coat excellent in adhesion to a metal, which is composed of a bisphenol F-type epoxy diacrylate and a specified reactive diluent.
CONSTITUTION: A reactive diluent (B), of formula I (wherein R1 is H or methyl; R2 is a 5W20C cyloalkyl, phenyl, tetrahydrofurfuryl or a 5W20C alkyl containing said groups), formula II [wherein R2 is a 2W40C alkylene; R4 is a 2W40C alkyl or alkylene (wherein the sum of carbon numbers in R2 and R4, ≤40)], formula III (wherein R5 is a 1W20C alkyl, vinyl, aryl or alkoxyalkyl), or formula IV [wherein R6 is a 2W12C alkylene, cycloalkylene or phenyl; X1WXn are 2W6C (monohydroxy) alkylene; n is an integer of 0W5), is compounded with a bisphenol F-type epoxy diacrylate (A). A crosslinkable monomer such as 1,3-butanediol diacrylate may be additionally compounded.
COPYRIGHT: (C)1981,JPO&Japio
JP10182279A 1979-08-10 1979-08-10 Polymerizable composition Pending JPS5626916A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10182279A JPS5626916A (en) 1979-08-10 1979-08-10 Polymerizable composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10182279A JPS5626916A (en) 1979-08-10 1979-08-10 Polymerizable composition

Publications (1)

Publication Number Publication Date
JPS5626916A true JPS5626916A (en) 1981-03-16

Family

ID=14310801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10182279A Pending JPS5626916A (en) 1979-08-10 1979-08-10 Polymerizable composition

Country Status (1)

Country Link
JP (1) JPS5626916A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989316A (en) * 1982-11-12 1984-05-23 Mitsui Toatsu Chem Inc Solder resist ink composition curable by ultraviolet rays
JPS61243876A (en) * 1985-04-18 1986-10-30 ヒルテイ・アクチエンゲゼルシヤフト Adhesive based on acrylic compound
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor encapsulation material
JP2002332320A (en) * 2001-05-08 2002-11-22 Denki Kagaku Kogyo Kk Curable resin composition, cured body, adhesive composition and bonded body

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989316A (en) * 1982-11-12 1984-05-23 Mitsui Toatsu Chem Inc Solder resist ink composition curable by ultraviolet rays
JPH0414151B2 (en) * 1982-11-12 1992-03-11 Mitsui Toatsu Chemicals
JPS61243876A (en) * 1985-04-18 1986-10-30 ヒルテイ・アクチエンゲゼルシヤフト Adhesive based on acrylic compound
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor encapsulation material
JP2002332320A (en) * 2001-05-08 2002-11-22 Denki Kagaku Kogyo Kk Curable resin composition, cured body, adhesive composition and bonded body

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