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JPS562630A - Installing of wafer position in projection aligner - Google Patents

Installing of wafer position in projection aligner

Info

Publication number
JPS562630A
JPS562630A JP7821379A JP7821379A JPS562630A JP S562630 A JPS562630 A JP S562630A JP 7821379 A JP7821379 A JP 7821379A JP 7821379 A JP7821379 A JP 7821379A JP S562630 A JPS562630 A JP S562630A
Authority
JP
Japan
Prior art keywords
wafer
distance
nozzle
reference surface
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7821379A
Other languages
Japanese (ja)
Inventor
Hiroshi Nishizuka
Mitsuhiro Morita
Takayoshi Oosakaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7821379A priority Critical patent/JPS562630A/en
Priority to GB8040959A priority patent/GB2063523B/en
Priority to GB8040960A priority patent/GB2063524B/en
Priority to GB7936237A priority patent/GB2035610B/en
Priority to DE19792942388 priority patent/DE2942388A1/en
Priority to US06/087,387 priority patent/US4298273A/en
Publication of JPS562630A publication Critical patent/JPS562630A/en
Priority to SG40884A priority patent/SG40884G/en
Priority to SG404/84A priority patent/SG40484G/en
Priority to HK356/85A priority patent/HK35685A/en
Priority to HK361/85A priority patent/HK36185A/en
Priority to HK684/85A priority patent/HK68485A/en
Priority to MY669/85A priority patent/MY8500669A/en
Priority to MY663/85A priority patent/MY8500663A/en
Priority to MY1985670A priority patent/MY8500670A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To dispose a wafer accurately at a focus surface in a projection aligner by stopping lowering the wafer when the distance between the wafer and the reference surface reaches the predetermined value at the measured value in case that the wafer completely retained horizontally is lowered to the focus surface. CONSTITUTION:When a wafer 4 retained by a chuck 5 is raised to make contact with a pad 9, the pressure is detected to stop raising the wafer, and to lower the wafer while measuring the distance between the wafer 4 and the reference surface by the nozzle 20 of an air micrometer. The nozzle pressure is converted by a converter 21 into an electric signal, is completed by a comparator 22 with the set value in a digital switch 13 beforehand to control a pulse motor 15 by a sequence controller 14. According to this configuration, since the leveling pad 9 measures the distance between the reference surface and the wafer in no contact state with the wafer, it cannot be affected by the irregular displacement of the pressure sensor 6 and the parallel drive unit 10. Since the nozzle 20 is mounted at the center of the wafer, the wafer can be mounted at the center on the focus surface, and when a pluralily of nozzles are provided to employ the mean value of the measured distance, it can be further improved in accuracy.
JP7821379A 1978-10-20 1979-06-22 Installing of wafer position in projection aligner Pending JPS562630A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP7821379A JPS562630A (en) 1979-06-22 1979-06-22 Installing of wafer position in projection aligner
GB8040959A GB2063523B (en) 1978-10-20 1979-10-18 Wafer position setting apparatus
GB8040960A GB2063524B (en) 1978-10-20 1979-10-18 Method of positioning a wafer in a projection aligner
GB7936237A GB2035610B (en) 1978-10-20 1979-10-18 Wafer projection aligner
DE19792942388 DE2942388A1 (en) 1978-10-20 1979-10-19 SEMICONDUCTOR DEVICE POSITIONING DEVICE
US06/087,387 US4298273A (en) 1978-10-20 1979-10-22 Projection aligner and method of positioning a wafer
SG404/84A SG40484G (en) 1978-10-20 1984-06-04 Projection aligner
SG40884A SG40884G (en) 1978-10-20 1984-06-04 A method of positioning a wafer in a projection aligner
HK356/85A HK35685A (en) 1978-10-20 1985-05-09 Projection aligner
HK361/85A HK36185A (en) 1978-10-20 1985-05-09 Wafer position setting apparatus
HK684/85A HK68485A (en) 1978-10-20 1985-09-12 A method of positioning a wafer in a projection aligner
MY669/85A MY8500669A (en) 1978-10-20 1985-12-30 Water position setting apparatus
MY663/85A MY8500663A (en) 1978-10-20 1985-12-30 Projection aligner
MY1985670A MY8500670A (en) 1978-10-20 1985-12-31 A method of positioning a wafer in a protection aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7821379A JPS562630A (en) 1979-06-22 1979-06-22 Installing of wafer position in projection aligner

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60099573A Division JPS611021A (en) 1985-05-13 1985-05-13 Position setting method in exposure equipment

Publications (1)

Publication Number Publication Date
JPS562630A true JPS562630A (en) 1981-01-12

Family

ID=13655760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7821379A Pending JPS562630A (en) 1978-10-20 1979-06-22 Installing of wafer position in projection aligner

Country Status (1)

Country Link
JP (1) JPS562630A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6048914A (en) * 1997-07-11 2000-04-11 Mitsubishi Pencil Kabushiki Kaisha Ink composition for writing instrument

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922868A (en) * 1972-06-20 1974-02-28
JPS5252579A (en) * 1975-10-27 1977-04-27 Canon Inc Clearance adjusng method
JPS5356974A (en) * 1976-11-01 1978-05-23 Ibm Device for positioning and maintaining target in attitude selected to standard attitude

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922868A (en) * 1972-06-20 1974-02-28
JPS5252579A (en) * 1975-10-27 1977-04-27 Canon Inc Clearance adjusng method
JPS5356974A (en) * 1976-11-01 1978-05-23 Ibm Device for positioning and maintaining target in attitude selected to standard attitude

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6048914A (en) * 1997-07-11 2000-04-11 Mitsubishi Pencil Kabushiki Kaisha Ink composition for writing instrument

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