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JPS5621352A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5621352A
JPS5621352A JP9631279A JP9631279A JPS5621352A JP S5621352 A JPS5621352 A JP S5621352A JP 9631279 A JP9631279 A JP 9631279A JP 9631279 A JP9631279 A JP 9631279A JP S5621352 A JPS5621352 A JP S5621352A
Authority
JP
Japan
Prior art keywords
liquid
semiconductor device
container
pipe
endurable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9631279A
Other languages
Japanese (ja)
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9631279A priority Critical patent/JPS5621352A/en
Publication of JPS5621352A publication Critical patent/JPS5621352A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a device endurable to strong external pressure by completely enclosing a liquid so that residual vapor may not exist in the space in an airtight container wherein the method similar to vacuum impregnation method is used. CONSTITUTION:A flat type semiconductor device 9 is completely buried in a liquid 17 in a container 16. The container 16 is accommodated in a vacuum tank 10 and vacuum condition is maintained for about ten minutes. Then, high pressure N2 gas is induced 14. The vapor existed in the space in the airtight container of the semiconductor device 9 is removed by this operation and the liquid 17 will be poured. Next, the container 16 is taken out and the semiconductor device 9 is removed from the liquid, the liquid 17 remained at the part of a pipe 8 for sealing is especially wiped off and sealing is done by heating the tip of the pipe 8. The pipe 8 is always positioned at the utmost section of the device 9 during this procedure and the perfect repletion of the liquid 17 and the discharge prevention of the injected liquid are tried. In this composition, a semiconductor device endurable to strong external pressure will be obtained.
JP9631279A 1979-07-28 1979-07-28 Manufacture of semiconductor device Pending JPS5621352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9631279A JPS5621352A (en) 1979-07-28 1979-07-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9631279A JPS5621352A (en) 1979-07-28 1979-07-28 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5621352A true JPS5621352A (en) 1981-02-27

Family

ID=14161499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9631279A Pending JPS5621352A (en) 1979-07-28 1979-07-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5621352A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146341U (en) * 1981-03-11 1982-09-14
JPS6032330A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device
JPS6032331A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device
JPS6032332A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146341U (en) * 1981-03-11 1982-09-14
JPS6032330A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device
JPS6032331A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device
JPS6032332A (en) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan Oil-sealed equalizing semiconductor device

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