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JPS56167336A - Manufacture of resin-sealed type module - Google Patents

Manufacture of resin-sealed type module

Info

Publication number
JPS56167336A
JPS56167336A JP6994080A JP6994080A JPS56167336A JP S56167336 A JPS56167336 A JP S56167336A JP 6994080 A JP6994080 A JP 6994080A JP 6994080 A JP6994080 A JP 6994080A JP S56167336 A JPS56167336 A JP S56167336A
Authority
JP
Japan
Prior art keywords
substrate
resin
case
sand
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6994080A
Other languages
Japanese (ja)
Inventor
Takashi Sasaki
Hideaki Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6994080A priority Critical patent/JPS56167336A/en
Publication of JPS56167336A publication Critical patent/JPS56167336A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent production of foams and improve reliability, by putting an electronic-circuit-loaded substrate into a case in such a position as to be inclined toward the bottom, filling it with sand silica, etc., and then, sealing it by pouring resin on the side where distance between the substrate and the bottom is shorter. CONSTITUTION:In a mold processing for sand casting of an electronic equipment to be used under an unfavorable environmental condition, an electronic-circuit-loaded substrate 2 to be housed in a case 1 is fixed in such a position as to be inclined toward the bottom of the case. After this case 1 is filled with a filler 3, such as silica and sand, etc., in such a manner as to embed the substrate 2 completely, such a material as epoxy resin 4 is poured on the side where distance between the substrate 2 and the bottom is shorter, and the resin 4 is hardened by being spread all over the surface. It is possible, by doing so, to release the air surrounded on the bottom of the substrate 2 slant-upwardly and to improve reliability of a module.
JP6994080A 1980-05-26 1980-05-26 Manufacture of resin-sealed type module Pending JPS56167336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6994080A JPS56167336A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6994080A JPS56167336A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Publications (1)

Publication Number Publication Date
JPS56167336A true JPS56167336A (en) 1981-12-23

Family

ID=13417155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6994080A Pending JPS56167336A (en) 1980-05-26 1980-05-26 Manufacture of resin-sealed type module

Country Status (1)

Country Link
JP (1) JPS56167336A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60932U (en) * 1983-06-16 1985-01-07 三菱電機株式会社 electronic circuit equipment
JPS60167340U (en) * 1984-04-16 1985-11-06 日本電気株式会社 Hybrid integrated circuit device
US6753578B2 (en) 2001-09-05 2004-06-22 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
JP2020188042A (en) * 2019-05-10 2020-11-19 三菱電機株式会社 Semiconductor device, power conversion device, and method of manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60932U (en) * 1983-06-16 1985-01-07 三菱電機株式会社 electronic circuit equipment
JPS60167340U (en) * 1984-04-16 1985-11-06 日本電気株式会社 Hybrid integrated circuit device
US6753578B2 (en) 2001-09-05 2004-06-22 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
JP2020188042A (en) * 2019-05-10 2020-11-19 三菱電機株式会社 Semiconductor device, power conversion device, and method of manufacturing semiconductor device

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