JPS56158891A - Electrolytic treatment of strip metallic plate - Google Patents

Abstract

PURPOSE: To perform high-speed electroplating of a striplike metallic plate at low power costs by suppressing the flow of electrolyte and performing no electrolysis in the low velocity filled part at the time of ejecting the electrolyte in counter current to the surface of the traveling striplike metallic plate.

CONSTITUTION: Electrolyte 11 is supplied at high speeds in counter current only to the plating surface of a striplike metallic plate 6 from the nozzles 9 and nozzle holes 9' provided in an electrode 7 and electricity is conducted, whereby plating is applied. At the same time, the overflowing liquid 11 is released into the space in a tank 1. Hence, there is no deposition of plating metal on the nonplating surface of the plate 6. Further, arrangement is so made that electricity is not conducted between a member 8 for preventing the back flow of the liquid 11 provided in contact with the nozzle 9-1 positioned in the extreme rear with respect to the blow out direction out of the nozzles 9 and the plate 6. As a result, electrolytic plating does not take place in the part of the member 8 in spite of filling of the liquid between said member and the plate 6. Hence, plating of so-called "burnt deposit" does not occur in the plated surface of the plate 6, and the smooth and uniform plated surface of good adhesive strength is obtained.

COPYRIGHT: (C)1981,JPO&Japio