JPS56152736A - Chemical vapor deposition device using decreased pressure - Google Patents
Chemical vapor deposition device using decreased pressureInfo
- Publication number
- JPS56152736A JPS56152736A JP5663980A JP5663980A JPS56152736A JP S56152736 A JPS56152736 A JP S56152736A JP 5663980 A JP5663980 A JP 5663980A JP 5663980 A JP5663980 A JP 5663980A JP S56152736 A JPS56152736 A JP S56152736A
- Authority
- JP
- Japan
- Prior art keywords
- chemical vapor
- rotary pump
- vapor phase
- vapor deposition
- deposition device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:To prevent the deterioration of a rotary pump and reduce its repair time by providing a plasma generating section between a chemical vapor phase reaction section and a vacuum exhaust system of a chemical vapor deposition device using decreased pressure. CONSTITUTION:A high-frequency power source 17 of the outside is connected between the 1st and 2nd electrodes 13, 15 and a plasma generating section C is provided between the chemical vapor phase reaction section A and vacuum exhaust system B of the decompression type chemical vapor phase growing device. A reacting gas 6 is put in a plasma state. Then, the unreacted gas or reacted formed gas cracks or electrolytically dissociates, and since this reduces the absorption in the oil of a rotary pump 11 or the decomposition of the oil, the deterioration of the rotary pump is prevented and its repair times are reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5663980A JPS56152736A (en) | 1980-04-25 | 1980-04-25 | Chemical vapor deposition device using decreased pressure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5663980A JPS56152736A (en) | 1980-04-25 | 1980-04-25 | Chemical vapor deposition device using decreased pressure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56152736A true JPS56152736A (en) | 1981-11-26 |
Family
ID=13032896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5663980A Pending JPS56152736A (en) | 1980-04-25 | 1980-04-25 | Chemical vapor deposition device using decreased pressure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152736A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59109138U (en) * | 1983-01-12 | 1984-07-23 | クラリオン株式会社 | Thin film vapor phase growth equipment |
JPS6078636A (en) * | 1983-10-04 | 1985-05-04 | Ulvac Corp | Plasma process apparatus utilizing chemical reaction |
-
1980
- 1980-04-25 JP JP5663980A patent/JPS56152736A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59109138U (en) * | 1983-01-12 | 1984-07-23 | クラリオン株式会社 | Thin film vapor phase growth equipment |
JPS6078636A (en) * | 1983-10-04 | 1985-05-04 | Ulvac Corp | Plasma process apparatus utilizing chemical reaction |
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