JPS56148846A - Manufacture of circuit pattern - Google Patents
Manufacture of circuit patternInfo
- Publication number
- JPS56148846A JPS56148846A JP5308680A JP5308680A JPS56148846A JP S56148846 A JPS56148846 A JP S56148846A JP 5308680 A JP5308680 A JP 5308680A JP 5308680 A JP5308680 A JP 5308680A JP S56148846 A JPS56148846 A JP S56148846A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductor
- circuit pattern
- resist
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 5
- 238000005530 etching Methods 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910001252 Pd alloy Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To obtain a microminiature circuit pattern by covering the first conductive film on a substrate, plating the second conductive film pattern thereon, then covering a protective film on the upper and side surfaces of the second film and etching the first film. CONSTITUTION:The first conductor 2 is formed on titanium-palladium alloy or the like on a substrate 1 made of alumina, glass or the like. Then, a resist 3 is covered thereon, and a pattern is formed thereon by an exposure development. Subsequently, the second conductor 4 is formed of copper, gold or the like by an elctric plating. Further, the resist 3 is thermally shrinked to form gaps 6, and a protective film 5 is formed on the gap 6 and on the second conductor 4. The film 5 may be any which can endure against the etchant of the first conductor 2, and preferably be metal. Eventually, the resist 3 is removed, the film 5 is used as a mask to etch the first conductor 2, and a circuit pattern is obtained. Since the film 5 exists thereon, it can prevent the sidewise etching at the time of etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5308680A JPS56148846A (en) | 1980-04-22 | 1980-04-22 | Manufacture of circuit pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5308680A JPS56148846A (en) | 1980-04-22 | 1980-04-22 | Manufacture of circuit pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56148846A true JPS56148846A (en) | 1981-11-18 |
Family
ID=12932967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5308680A Pending JPS56148846A (en) | 1980-04-22 | 1980-04-22 | Manufacture of circuit pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56148846A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040028458A (en) * | 2002-09-30 | 2004-04-03 | (주)울텍 | The method of Copper electroplating on the flat copper plate |
| EP1439575A3 (en) * | 2003-01-16 | 2006-10-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device with a lead frame and method of manufacturing the same |
| JP2008091454A (en) * | 2006-09-29 | 2008-04-17 | Rohm Co Ltd | Semiconductor device and manufacturing method therefor |
-
1980
- 1980-04-22 JP JP5308680A patent/JPS56148846A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040028458A (en) * | 2002-09-30 | 2004-04-03 | (주)울텍 | The method of Copper electroplating on the flat copper plate |
| EP1439575A3 (en) * | 2003-01-16 | 2006-10-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device with a lead frame and method of manufacturing the same |
| US7659634B2 (en) | 2003-01-16 | 2010-02-09 | Panasonic Corporation | Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device |
| US7723161B2 (en) | 2003-01-16 | 2010-05-25 | Panasonic Corporation | Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device |
| JP2008091454A (en) * | 2006-09-29 | 2008-04-17 | Rohm Co Ltd | Semiconductor device and manufacturing method therefor |
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