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JPS56148843A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56148843A
JPS56148843A JP5206780A JP5206780A JPS56148843A JP S56148843 A JPS56148843 A JP S56148843A JP 5206780 A JP5206780 A JP 5206780A JP 5206780 A JP5206780 A JP 5206780A JP S56148843 A JPS56148843 A JP S56148843A
Authority
JP
Japan
Prior art keywords
titanium
molybdenum
evaporated
substrate
thereafter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5206780A
Other languages
Japanese (ja)
Inventor
Masayoshi Ozaki
Yoshikazu Chatani
Osamu Kyogoku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP5206780A priority Critical patent/JPS56148843A/en
Publication of JPS56148843A publication Critical patent/JPS56148843A/en
Pending legal-status Critical Current

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To form an electrode which utilizes the features of molybdenum for a semiconductor device by interposing the molybdenum between titanium thin films an forming a three-layer structure of titanium-molybdenum-titanium. CONSTITUTION:A silicon substrate 3 on which a silicon oxide film 1 and a high density region 2 are exposed on the main surface is prepared. Then, titanium 4 is evaporated by an electron beam evaporation on the main surface of the silicon substrate. Thereafter, molybdenum 5 is evaporated thereon, and titanium 6 is further evaporated thereon. Subsequently, the substrate thus evaporated is patterned by a photodetecting step to form an electrode. Then, in order to decrease the wiring resistance, te substrate is heat treated at 400-600 deg.C in an inert gas. Thereafter, silicon oxide is formed as a protection film 7 thereon by a vapor phase growth. Since the titanium layers are interposed, the films have good adherence, and no sidewise etching occurs at the time of etching.
JP5206780A 1980-04-18 1980-04-18 Semiconductor device Pending JPS56148843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5206780A JPS56148843A (en) 1980-04-18 1980-04-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5206780A JPS56148843A (en) 1980-04-18 1980-04-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56148843A true JPS56148843A (en) 1981-11-18

Family

ID=12904460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5206780A Pending JPS56148843A (en) 1980-04-18 1980-04-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56148843A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268291B1 (en) * 1995-12-29 2001-07-31 International Business Machines Corporation Method for forming electromigration-resistant structures by doping

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268291B1 (en) * 1995-12-29 2001-07-31 International Business Machines Corporation Method for forming electromigration-resistant structures by doping

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