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JPS56138692A - Condenser - Google Patents

Condenser

Info

Publication number
JPS56138692A
JPS56138692A JP4265080A JP4265080A JPS56138692A JP S56138692 A JPS56138692 A JP S56138692A JP 4265080 A JP4265080 A JP 4265080A JP 4265080 A JP4265080 A JP 4265080A JP S56138692 A JPS56138692 A JP S56138692A
Authority
JP
Japan
Prior art keywords
cooling
condenser
boiling
floor
lowest
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4265080A
Other languages
Japanese (ja)
Inventor
Haruo Tetsuno
Toshio Mikane
Makoto Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4265080A priority Critical patent/JPS56138692A/en
Publication of JPS56138692A publication Critical patent/JPS56138692A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To miniaturize the device and improve cooling performance by a method wherein the area of cooling pieces arranged in a plurality of cooling pipes is made maximum at the lowest one in the condenser used for a boiling-cooling device mounted under the floor of an electric car and the like.
CONSTITUTION: In the condenser which is suited for a boiling-cooling device cooling a heating body such as a semiconductor by utilizing the change in phase between the liquid and vapor phases of a cooling medium condensed by boiling, a plurality of cooling pipes provided with cooling pieces are communicated in a plurality of stages through the intermediary of headers 4 and 5. On the occasion, the ratio of the area of the cooling piece 3A of the cooling pipe 2A in the upper stage to that of the cooling piece 3B of the cooling pipe 2B in the lowest stafe is set to be 3B>3A. When the condenser is arranged under the floor of the electric car or the like, running wind positioned apart from the floor and having a large velocity can be passed through the cooling pieces by this constitution, and therefore, the condensating performance of the cooling pipe 2B located in the lowest stage is improved and the condenser can be miniaturized.
COPYRIGHT: (C)1981,JPO&Japio
JP4265080A 1980-03-31 1980-03-31 Condenser Pending JPS56138692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4265080A JPS56138692A (en) 1980-03-31 1980-03-31 Condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4265080A JPS56138692A (en) 1980-03-31 1980-03-31 Condenser

Publications (1)

Publication Number Publication Date
JPS56138692A true JPS56138692A (en) 1981-10-29

Family

ID=12641877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4265080A Pending JPS56138692A (en) 1980-03-31 1980-03-31 Condenser

Country Status (1)

Country Link
JP (1) JPS56138692A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146167A (en) * 1977-05-25 1978-12-19 Mitsubishi Electric Corp Accommodation board for electronic parts

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146167A (en) * 1977-05-25 1978-12-19 Mitsubishi Electric Corp Accommodation board for electronic parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant

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