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JPS56133856A - Epoxy resin composition for sealing semiconductor - Google Patents

Epoxy resin composition for sealing semiconductor

Info

Publication number
JPS56133856A
JPS56133856A JP3670680A JP3670680A JPS56133856A JP S56133856 A JPS56133856 A JP S56133856A JP 3670680 A JP3670680 A JP 3670680A JP 3670680 A JP3670680 A JP 3670680A JP S56133856 A JPS56133856 A JP S56133856A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
urea
molding
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3670680A
Other languages
Japanese (ja)
Inventor
Matsuro Kanehara
Masakazu Sugimoto
Kazuhisa Yamatani
Masahito Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP3670680A priority Critical patent/JPS56133856A/en
Publication of JPS56133856A publication Critical patent/JPS56133856A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the molding workability of resin seal for a semiconductor element by making an epoxy resin composition containing phenolic novolak as a hardener contain an urea derivative as a hardender. CONSTITUTION:Phenolic novolak, which is contained in a semiconductor sealing epoxy resin composition as a hardening promotor, is made to contain an urea derivative of formula, R1NHCON-R2, -R2 (where R1 represents hydrogen, alkyl, or aromatic group which may have substituent group, and R2 represents alkyl group), e.g., N.N-dimethyl urea or N.N-diethyl urea. Thereby, the hardening reaction in molding is speeded up, the degree of cure is increased, and the mold release of the hardened substance is improved, so that the molding workability of semiconductor sealing is improved.
JP3670680A 1980-03-21 1980-03-21 Epoxy resin composition for sealing semiconductor Pending JPS56133856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3670680A JPS56133856A (en) 1980-03-21 1980-03-21 Epoxy resin composition for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3670680A JPS56133856A (en) 1980-03-21 1980-03-21 Epoxy resin composition for sealing semiconductor

Publications (1)

Publication Number Publication Date
JPS56133856A true JPS56133856A (en) 1981-10-20

Family

ID=12477209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3670680A Pending JPS56133856A (en) 1980-03-21 1980-03-21 Epoxy resin composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS56133856A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213720A (en) * 1983-05-19 1984-12-03 Mitsui Petrochem Ind Ltd Epoxy resin composition
JPS62161817A (en) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd Epoxy resin composition
JPS63280725A (en) * 1987-05-13 1988-11-17 Toshiba Chem Corp Resin composition for sealing
JPH0489820A (en) * 1990-08-02 1992-03-24 Mitsui Petrochem Ind Ltd Adhesive for hermetic sealing of electronic part and junction member
US7750107B2 (en) * 2003-05-30 2010-07-06 Alzchem Trostberg Gmbh Substituted urea accelerator with dicyandiamide for epoxy resin systems
JP2014503668A (en) * 2011-01-31 2014-02-13 ハンツマン・インターナショナル・エルエルシー Epoxy resin composition
TWI504710B (en) * 2009-10-01 2015-10-21 Adeka Corp Adhesive resin composition for silicon wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463194A (en) * 1977-10-15 1979-05-21 Sekisui Plastics Method of making foamable thermoplastic resin particles

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463194A (en) * 1977-10-15 1979-05-21 Sekisui Plastics Method of making foamable thermoplastic resin particles

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213720A (en) * 1983-05-19 1984-12-03 Mitsui Petrochem Ind Ltd Epoxy resin composition
JPS62161817A (en) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd Epoxy resin composition
JPS63280725A (en) * 1987-05-13 1988-11-17 Toshiba Chem Corp Resin composition for sealing
JPH0489820A (en) * 1990-08-02 1992-03-24 Mitsui Petrochem Ind Ltd Adhesive for hermetic sealing of electronic part and junction member
US7750107B2 (en) * 2003-05-30 2010-07-06 Alzchem Trostberg Gmbh Substituted urea accelerator with dicyandiamide for epoxy resin systems
TWI504710B (en) * 2009-10-01 2015-10-21 Adeka Corp Adhesive resin composition for silicon wafer
JP2014503668A (en) * 2011-01-31 2014-02-13 ハンツマン・インターナショナル・エルエルシー Epoxy resin composition

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