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JPS561264A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS561264A
JPS561264A JP7522179A JP7522179A JPS561264A JP S561264 A JPS561264 A JP S561264A JP 7522179 A JP7522179 A JP 7522179A JP 7522179 A JP7522179 A JP 7522179A JP S561264 A JPS561264 A JP S561264A
Authority
JP
Japan
Prior art keywords
outlet
solder
pressing chamber
chamber
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7522179A
Other languages
Japanese (ja)
Inventor
Katsuki Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7522179A priority Critical patent/JPS561264A/en
Publication of JPS561264A publication Critical patent/JPS561264A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To enable stable soldering with extremely simple constitution by dividing the pressing chamber ot plural pressure regulating chambers in the jet type soldering device which jets out molten solder from the pressing chamber outlet and presses and sucks the same through the inlet. CONSTITUTION:The molten solder in a vessel 1 which is divided by a shield plate 4 blows out from the outlet 6 of the chamber enclosed by the plate 4 and vessel 1, that is, pressing chamber, is sucked through an inlet 5 and again reaches the outlet 6 by way of the pressing chamber. This solder flow is created by a pressing fan 7 and the article to be soldered is passed through the solder jet flow from the outlet 6, whereby it is soldered. Here, the pressing chamber is divided to three chambers 13-15 by partition plates 11, 12 of flat plates, by which the molten solder having been pressed is sent by being subsequently reduced of pressure from the chamber 13 to 14, and from 14 to 15. In this process, the solder turbulence becomes laminar flow and the jet flow from the outlet 6 becomes stable with considerably less variations in its height.
JP7522179A 1979-06-14 1979-06-14 Soldering device Pending JPS561264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7522179A JPS561264A (en) 1979-06-14 1979-06-14 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7522179A JPS561264A (en) 1979-06-14 1979-06-14 Soldering device

Publications (1)

Publication Number Publication Date
JPS561264A true JPS561264A (en) 1981-01-08

Family

ID=13569944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7522179A Pending JPS561264A (en) 1979-06-14 1979-06-14 Soldering device

Country Status (1)

Country Link
JP (1) JPS561264A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141459U (en) * 1984-08-18 1986-03-17 クラリオン株式会社 Jet flow automatic soldering device
JPS6410361U (en) * 1987-07-02 1989-01-19
US5193734A (en) * 1991-01-28 1993-03-16 Sony Corporation Jet solder bath
WO2010087341A1 (en) * 2009-01-27 2010-08-05 千住金属工業株式会社 Jet solder bath

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141459U (en) * 1984-08-18 1986-03-17 クラリオン株式会社 Jet flow automatic soldering device
JPS6410361U (en) * 1987-07-02 1989-01-19
JPH0534849Y2 (en) * 1987-07-02 1993-09-03
US5193734A (en) * 1991-01-28 1993-03-16 Sony Corporation Jet solder bath
WO2010087341A1 (en) * 2009-01-27 2010-08-05 千住金属工業株式会社 Jet solder bath
JP2010177287A (en) * 2009-01-27 2010-08-12 Senju Metal Ind Co Ltd Jet solder bath

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