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JPS56122152A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122152A
JPS56122152A JP2503180A JP2503180A JPS56122152A JP S56122152 A JPS56122152 A JP S56122152A JP 2503180 A JP2503180 A JP 2503180A JP 2503180 A JP2503180 A JP 2503180A JP S56122152 A JPS56122152 A JP S56122152A
Authority
JP
Japan
Prior art keywords
evaporator
semiconductor device
parallel elements
electrically
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2503180A
Other languages
Japanese (ja)
Other versions
JPS6127915B2 (en
Inventor
Haruo Tetsuno
Shogo Itano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2503180A priority Critical patent/JPS56122152A/en
Publication of JPS56122152A publication Critical patent/JPS56122152A/en
Publication of JPS6127915B2 publication Critical patent/JPS6127915B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the reliability in the airtightness of a boiling cooling type semiconductor device and reduce the manufacturing cost thereof by electrically connecting parallel elements to an evaporator via a hollow pipe arranged within a heat transfer tube. CONSTITUTION:A heat transfer tube 9 is formed of an insulating tube 9A connected at one end of a liquid storage container 7 and bellows 9B connected to an evaporator 9A to electrically insulate the evaporator 6 via a semiconductor element 1 from the container 7. A hollow pipe 13 is formed of insulator, metallic layers 13B and 13C are formed on the inner surface and the outer surfaces of both ends of the pipe 13 and electrically conducted. Further, the pipe 13 is connected via conductors 5A, 5B to electrically connect the parallel elements 3 to the evaporator 6. Cooling medium 12 is circulated to cool the semiconductor element 1 and the parallel elements 3. Thus, an airtight terminal is unnecessary to improve the reliability in the airtightness of the semiconductor device.
JP2503180A 1980-02-28 1980-02-28 Semiconductor device Granted JPS56122152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2503180A JPS56122152A (en) 1980-02-28 1980-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2503180A JPS56122152A (en) 1980-02-28 1980-02-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56122152A true JPS56122152A (en) 1981-09-25
JPS6127915B2 JPS6127915B2 (en) 1986-06-27

Family

ID=12154536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2503180A Granted JPS56122152A (en) 1980-02-28 1980-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122152A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2544918A1 (en) * 1983-03-04 1984-10-26 Bbc Brown Boveri & Cie SPRAY REFRIGERATION DEVICE FOR POWER SEMICONDUCTOR ELEMENTS
US4982274A (en) * 1988-12-14 1991-01-01 The Furukawa Electric Co., Ltd. Heat pipe type cooling apparatus for semiconductor
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2544918A1 (en) * 1983-03-04 1984-10-26 Bbc Brown Boveri & Cie SPRAY REFRIGERATION DEVICE FOR POWER SEMICONDUCTOR ELEMENTS
US4982274A (en) * 1988-12-14 1991-01-01 The Furukawa Electric Co., Ltd. Heat pipe type cooling apparatus for semiconductor
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property

Also Published As

Publication number Publication date
JPS6127915B2 (en) 1986-06-27

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