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JPS56116654A - Manufacturing of lead frame for semiconductor device - Google Patents

Manufacturing of lead frame for semiconductor device

Info

Publication number
JPS56116654A
JPS56116654A JP2011380A JP2011380A JPS56116654A JP S56116654 A JPS56116654 A JP S56116654A JP 2011380 A JP2011380 A JP 2011380A JP 2011380 A JP2011380 A JP 2011380A JP S56116654 A JPS56116654 A JP S56116654A
Authority
JP
Japan
Prior art keywords
lead
frame
manufacturing
lead frame
supporting frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011380A
Other languages
Japanese (ja)
Inventor
Koichi Takegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2011380A priority Critical patent/JPS56116654A/en
Publication of JPS56116654A publication Critical patent/JPS56116654A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To minimize deformation of an inner lead, which occurs during processing of a lead frame, by forming the inner lead after plating of the lead frame. CONSTITUTION:A lead frame is equipped with a loading section 1 for attaching a semiconductor element, an inner lead 2, an outer lead 3, an outer lead supporting frame 4 and a frame 5. When manufacturing this lead frame, plating work is conducted in the condition that the supporting frame 6 is provided in the neighborhood of the center of the lead 3 like the supporting frame 4, or in the case of manufacturing the lead frame by a press which removes unnecessary portions gradually, the plating work is done immediately before cutting the lead 3 off. And then, by blanking out the supporting frame or the unnecessary portion and separating the leads 3 from one another, a required lead frame is obtained. When this process is used, the lead 3 in plating is provided with the supporting frame, it can be prevented from deforming.
JP2011380A 1980-02-20 1980-02-20 Manufacturing of lead frame for semiconductor device Pending JPS56116654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011380A JPS56116654A (en) 1980-02-20 1980-02-20 Manufacturing of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011380A JPS56116654A (en) 1980-02-20 1980-02-20 Manufacturing of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS56116654A true JPS56116654A (en) 1981-09-12

Family

ID=12018058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011380A Pending JPS56116654A (en) 1980-02-20 1980-02-20 Manufacturing of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS56116654A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176260A (en) * 1984-02-23 1985-09-10 Toshiba Corp Manufacture of lead frame for semiconductor device
JPS61216353A (en) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPS6281738A (en) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd Lead frame and semiconductor device using the same
JPS63124938A (en) * 1986-11-14 1988-05-28 Omron Tateisi Electronics Co Lighting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176260A (en) * 1984-02-23 1985-09-10 Toshiba Corp Manufacture of lead frame for semiconductor device
JPS61216353A (en) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPS6281738A (en) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd Lead frame and semiconductor device using the same
JPH0455341B2 (en) * 1985-10-07 1992-09-03 Hitachi Maikuro Konpyuuta Enjiniaringu Kk
JPS63124938A (en) * 1986-11-14 1988-05-28 Omron Tateisi Electronics Co Lighting device

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