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JPS5599725A - Method and device for manufacturing semiconductor device - Google Patents

Method and device for manufacturing semiconductor device

Info

Publication number
JPS5599725A
JPS5599725A JP836379A JP836379A JPS5599725A JP S5599725 A JPS5599725 A JP S5599725A JP 836379 A JP836379 A JP 836379A JP 836379 A JP836379 A JP 836379A JP S5599725 A JPS5599725 A JP S5599725A
Authority
JP
Japan
Prior art keywords
liquid
sprayed
nozzle
developing liquid
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP836379A
Other languages
Japanese (ja)
Inventor
Hideaki Shimoda
Tadanaka Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP836379A priority Critical patent/JPS5599725A/en
Publication of JPS5599725A publication Critical patent/JPS5599725A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To prevent the occurrence of pattern defects in a device in which developing liquid and rinsing liquid are sprayed over a wafer surface, by spraying the rinsing liquid also to an outer frame which prevents the leakage of the developing liquid outside and then, washing off the developing liquid.
CONSTITUTION: Over the surface of a wafer 11 fixed on a rotating sample base 12, developing liquid is sprayed from a nozzle 14 and the unnecessary part of a photoresist is removed. Next, rinsing liquid is sprayed from a nozzle 15 over the surface of the wafer 11. At this time, rinsing liquid is sprayed also from a nozzle 18 to the inner wall 17 to wash off the developing liquid sticked to the inner wall. By so doing, pattern defects do not occur even if liquid sticked to the inner wall of an outer frame 16 drops on the surface of a sample and sticks to it, therefore, available yield percentage can be improved.
COPYRIGHT: (C)1980,JPO&Japio
JP836379A 1979-01-26 1979-01-26 Method and device for manufacturing semiconductor device Pending JPS5599725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP836379A JPS5599725A (en) 1979-01-26 1979-01-26 Method and device for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP836379A JPS5599725A (en) 1979-01-26 1979-01-26 Method and device for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5599725A true JPS5599725A (en) 1980-07-30

Family

ID=11691142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP836379A Pending JPS5599725A (en) 1979-01-26 1979-01-26 Method and device for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5599725A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898640U (en) * 1981-12-26 1983-07-05 三菱電機株式会社 automatic developing device
JPS61183528U (en) * 1985-05-09 1986-11-15
JPS63136528A (en) * 1986-11-27 1988-06-08 Mitsubishi Electric Corp Applicator for treatment liquid
JPS645437U (en) * 1987-06-26 1989-01-12
KR101090347B1 (en) * 2010-02-09 2011-12-07 주식회사 케이씨텍 Board Etcher

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898640U (en) * 1981-12-26 1983-07-05 三菱電機株式会社 automatic developing device
JPS61183528U (en) * 1985-05-09 1986-11-15
JPH0238439Y2 (en) * 1985-05-09 1990-10-17
JPS63136528A (en) * 1986-11-27 1988-06-08 Mitsubishi Electric Corp Applicator for treatment liquid
JPS645437U (en) * 1987-06-26 1989-01-12
KR101090347B1 (en) * 2010-02-09 2011-12-07 주식회사 케이씨텍 Board Etcher

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