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JPS5580903A - Microwave device - Google Patents

Microwave device

Info

Publication number
JPS5580903A
JPS5580903A JP15371178A JP15371178A JPS5580903A JP S5580903 A JPS5580903 A JP S5580903A JP 15371178 A JP15371178 A JP 15371178A JP 15371178 A JP15371178 A JP 15371178A JP S5580903 A JPS5580903 A JP S5580903A
Authority
JP
Japan
Prior art keywords
substrate
electromagnetic connection
slit
semi
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15371178A
Other languages
Japanese (ja)
Inventor
Takeshi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15371178A priority Critical patent/JPS5580903A/en
Publication of JPS5580903A publication Critical patent/JPS5580903A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices

Landscapes

  • Control Of Motors That Do Not Use Commutators (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Abstract

PURPOSE:To miniaturize the microwave device by forming the external circuit and the electromagnetic connection part into one chip in the form of the IC substrate and then fitting the chip into the slit which is formed previously at part of the semi- coaxial resonator. CONSTITUTION:Three slits 22-1, 22-2 and 22-3 which are extending toward the axis are formed about equidistantly on the bottom surface of semi-coaxial resonator 21. Three microwave semiconductor integrated circuit substrate are mounted to these three slits respectively. These three substrate are classified into those for phase detection, oscillation and frequency control purposes each, consisting roughly of external circuit 42 on the surface of substrate 41 made of the sapphire and electromagnetic connection part 43 led out of circuit 42. And the electromagnetic connection is given between part 43 and resonator 21 via the slit.
JP15371178A 1978-12-14 1978-12-14 Microwave device Pending JPS5580903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15371178A JPS5580903A (en) 1978-12-14 1978-12-14 Microwave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15371178A JPS5580903A (en) 1978-12-14 1978-12-14 Microwave device

Publications (1)

Publication Number Publication Date
JPS5580903A true JPS5580903A (en) 1980-06-18

Family

ID=15568417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15371178A Pending JPS5580903A (en) 1978-12-14 1978-12-14 Microwave device

Country Status (1)

Country Link
JP (1) JPS5580903A (en)

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