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JPS556832A - Method of manufacturing flexible circuit substrate - Google Patents

Method of manufacturing flexible circuit substrate

Info

Publication number
JPS556832A
JPS556832A JP7895378A JP7895378A JPS556832A JP S556832 A JPS556832 A JP S556832A JP 7895378 A JP7895378 A JP 7895378A JP 7895378 A JP7895378 A JP 7895378A JP S556832 A JPS556832 A JP S556832A
Authority
JP
Japan
Prior art keywords
flexible circuit
circuit substrate
manufacturing flexible
manufacturing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7895378A
Other languages
Japanese (ja)
Inventor
Masanobu Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP7895378A priority Critical patent/JPS556832A/en
Priority to FR7916747A priority patent/FR2430168A1/en
Priority to BE0/196027A priority patent/BE877349A/en
Priority to GB7922633A priority patent/GB2030007A/en
Priority to DE19792926335 priority patent/DE2926335A1/en
Priority to IT24023/79A priority patent/IT1121983B/en
Publication of JPS556832A publication Critical patent/JPS556832A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP7895378A 1978-06-29 1978-06-29 Method of manufacturing flexible circuit substrate Pending JPS556832A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP7895378A JPS556832A (en) 1978-06-29 1978-06-29 Method of manufacturing flexible circuit substrate
FR7916747A FR2430168A1 (en) 1978-06-29 1979-06-28 METHOD FOR MANUFACTURING A CIRCUIT BOARD OF THE FLEXIBLE TYPE
BE0/196027A BE877349A (en) 1978-06-29 1979-06-28 METHOD FOR MANUFACTURING A FLEXIBLE TYPE CIRCUIT BOARD
GB7922633A GB2030007A (en) 1978-06-29 1979-06-29 Printed circuit board manufacture
DE19792926335 DE2926335A1 (en) 1978-06-29 1979-06-29 METHOD FOR PRODUCING PRINTED CIRCUITS
IT24023/79A IT1121983B (en) 1978-06-29 1979-06-29 PROCEDURE FOR THE MANUFACTURE OF A FLEXIBLE CIRCUIT PANEL

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7895378A JPS556832A (en) 1978-06-29 1978-06-29 Method of manufacturing flexible circuit substrate

Publications (1)

Publication Number Publication Date
JPS556832A true JPS556832A (en) 1980-01-18

Family

ID=13676244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7895378A Pending JPS556832A (en) 1978-06-29 1978-06-29 Method of manufacturing flexible circuit substrate

Country Status (6)

Country Link
JP (1) JPS556832A (en)
BE (1) BE877349A (en)
DE (1) DE2926335A1 (en)
FR (1) FR2430168A1 (en)
GB (1) GB2030007A (en)
IT (1) IT1121983B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877291A (en) * 1981-11-02 1983-05-10 松下電器産業株式会社 Method of producing printed circuit board
JPS6017991A (en) * 1983-07-12 1985-01-29 株式会社東芝 Method of producing through hole substrate
JPS62183197A (en) * 1986-02-06 1987-08-11 凸版印刷株式会社 Flexible through-hole circuit substrate and manufacture of the same
JPS62209894A (en) * 1986-03-10 1987-09-16 凸版印刷株式会社 Manufacture of flexible through-hole circuit board
JPH0344095A (en) * 1989-07-11 1991-02-25 Matsushita Electric Ind Co Ltd Screen printer corresponding to through-hole printing
JPH03501060A (en) * 1989-03-21 1991-03-07 エンドレス　ウント　ハウザー　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング　ウント　コンパニー Capacitive pressure sensor and its manufacturing method
JPH09346U (en) * 1986-02-10 1997-06-10 マレリ・オートロニカ・ソシエタ・ペル・アチオニ Electrical parts that are mechanically connected

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525851A1 (en) * 1982-04-23 1983-10-28 Italtel Italiana Telecomunica Making conductive holes in PCB - by using two chambers with volume of one increases as other decreases as ink is forced through
DE3245458A1 (en) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Method for producing through-plated contacts in thick-film technology
BE896966A (en) * 1983-06-06 1983-12-06 Bell Telephone Mfg SCREEN PRINTING PROCESS AND DEVICE AND ELIMINATED ELECTRIC PRINTED CHAINS
GB2142478A (en) * 1983-07-01 1985-01-16 Welwyn Electronics Ltd Printed circuit boards
IT1165498B (en) * 1983-12-20 1987-04-22 Italtel Spa METHOD FOR COATING THE WALLS OF HOLES THROUGH SUPPORTS FOR ELECTRIC CIRCUITS AND MACHINE TO IMPLEMENT TLAE WITH AN INK
DE3429236A1 (en) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE
SE453708B (en) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab STONE PRINTING MACHINE TO CREATE A MATERIAL LAYER ON AN INNER WALL PART FOR A THROUGH HALL IN A PLATE
DE3509627A1 (en) * 1985-03-16 1986-09-18 Philips Patentverwaltung Gmbh, 2000 Hamburg Device for making through-contact in the case of holes in thick-film circuit boards
FR2580135B1 (en) * 1985-04-05 1988-08-12 Trt Telecom Radio Electr
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
DE3545258A1 (en) * 1985-12-20 1987-06-25 Licentia Gmbh Method for producing circuits using thin-film technology
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
JPH0834340B2 (en) * 1988-12-09 1996-03-29 日立化成工業株式会社 Wiring board and manufacturing method thereof
JPH0635499Y2 (en) * 1989-08-09 1994-09-14 ファイン電子株式会社 Double sided printed circuit board
FR2654296B1 (en) * 1989-11-03 1992-01-10 Horlogerie Photograph Fse TWO - SIDED PRINTED CIRCUIT, AND METHOD FOR THE PRODUCTION THEREOF.
DE19724366A1 (en) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Process for the through-connection of printed circuit boards
EP1870491B1 (en) 2006-06-22 2015-05-27 Enthone, Inc. Improved process for the direct metallisation of nonconductive substrates, particularly polyimide surfaces
US7645943B2 (en) 2007-07-11 2010-01-12 Delphi Technologies, Inc. Configurable printed circuit board
CN113380630A (en) * 2020-03-09 2021-09-10 重庆川仪微电路有限责任公司 Method for metallizing thick film circuit hole and method for printing thick film circuit
CN113643985A (en) * 2021-08-06 2021-11-12 西安微电子技术研究所 Method for realizing interconnection of front and back patterns of thick film substrate
IT202200009725A1 (en) * 2022-05-11 2023-11-11 Tastitalia S R L Flexible printed circuit obtained with a semi-additive process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939932A (en) * 1972-08-26 1974-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939932A (en) * 1972-08-26 1974-04-15

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877291A (en) * 1981-11-02 1983-05-10 松下電器産業株式会社 Method of producing printed circuit board
JPS6017991A (en) * 1983-07-12 1985-01-29 株式会社東芝 Method of producing through hole substrate
JPS62183197A (en) * 1986-02-06 1987-08-11 凸版印刷株式会社 Flexible through-hole circuit substrate and manufacture of the same
JPH09346U (en) * 1986-02-10 1997-06-10 マレリ・オートロニカ・ソシエタ・ペル・アチオニ Electrical parts that are mechanically connected
JPS62209894A (en) * 1986-03-10 1987-09-16 凸版印刷株式会社 Manufacture of flexible through-hole circuit board
JPH03501060A (en) * 1989-03-21 1991-03-07 エンドレス　ウント　ハウザー　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング　ウント　コンパニー Capacitive pressure sensor and its manufacturing method
JPH0344095A (en) * 1989-07-11 1991-02-25 Matsushita Electric Ind Co Ltd Screen printer corresponding to through-hole printing

Also Published As

Publication number Publication date
IT1121983B (en) 1986-04-23
GB2030007A (en) 1980-03-26
DE2926335A1 (en) 1980-01-10
IT7924023A0 (en) 1979-06-29
FR2430168A1 (en) 1980-01-25
BE877349A (en) 1979-12-28

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