JPS5559744A - Pressure welding type semiconductor device - Google Patents
Pressure welding type semiconductor deviceInfo
- Publication number
- JPS5559744A JPS5559744A JP13291278A JP13291278A JPS5559744A JP S5559744 A JPS5559744 A JP S5559744A JP 13291278 A JP13291278 A JP 13291278A JP 13291278 A JP13291278 A JP 13291278A JP S5559744 A JPS5559744 A JP S5559744A
- Authority
- JP
- Japan
- Prior art keywords
- electrode bodies
- substrate body
- pressure
- semiconductor substrate
- insulating packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000005493 welding type Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 6
- 238000012856 packing Methods 0.000 abstract 4
- 239000012212 insulator Substances 0.000 abstract 2
- 238000003825 pressing Methods 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To simply assemble this device in a pressure welding shape without needing special sealing work, by arranging a pair of electrode bodies to a semiconductor substrate body of this pressure welding type semiconductor device, by disposing an elastic insulator between the electrode bodies and by applying pressure between the electrodes.
CONSTITUTION: A ring-shaped insulating packing 15 manufactured by molding an elastic insulator such as silicon rubber or plastic is arranged surrounding a semiconductor substrate body 11, and metallic electrode bodies 16, 17 with conductivity and heat transfer properties are disposed as as to hole these substrate body and packing. An airtight vessel is formed in such a manner that the electrode bodies and the semiconductor substrate are electrically connected by pressure-welding them by applying pressure between the electrode bodies through cooling fins, and the electrode bodies and the insulating packing are pressure-welded. Assembly can further be facilitated by mounting a pair of tongue pieces 15a, 15b, which inner diameters D are equal to an outer diameter d of the semiconductor substrate body and are inward projected at an interval T larger than the thickness t of the substrate body, to the insulating packing 15.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291278A JPS5559744A (en) | 1978-10-27 | 1978-10-27 | Pressure welding type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291278A JPS5559744A (en) | 1978-10-27 | 1978-10-27 | Pressure welding type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5559744A true JPS5559744A (en) | 1980-05-06 |
Family
ID=15092420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13291278A Pending JPS5559744A (en) | 1978-10-27 | 1978-10-27 | Pressure welding type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5559744A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734755A (en) * | 1984-06-09 | 1988-03-29 | Semikron Gesellschaft Fur Gleichrichterbau | Alternating load stable switchable semiconductor device |
-
1978
- 1978-10-27 JP JP13291278A patent/JPS5559744A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734755A (en) * | 1984-06-09 | 1988-03-29 | Semikron Gesellschaft Fur Gleichrichterbau | Alternating load stable switchable semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1152654A (en) | Explosion-proof semiconductor device | |
| US2744218A (en) | Sealed rectifier unit and method of making the same | |
| US2827597A (en) | Rectifying mounting | |
| GB768103A (en) | Improvements in or relating to semiconductor devices | |
| US3585454A (en) | Improved case member for a light activated semiconductor device | |
| US3328650A (en) | Compression bonded semiconductor device | |
| US3025435A (en) | Casing for semiconductor diode | |
| JPS5559744A (en) | Pressure welding type semiconductor device | |
| US3536964A (en) | Semiconductor device sealed gas-tight by thixotropic material | |
| US3065390A (en) | Electrical devices having hermetically saled envelopes | |
| US3066248A (en) | Semiconductor device | |
| US2941250A (en) | Reaction vessel | |
| US3117179A (en) | Transistor capsule and header therefor | |
| JPS5568057A (en) | Electron gun | |
| SU651432A1 (en) | Aid for pressing pellet-type semiconductor device to cooler | |
| JPS54161272A (en) | Flat semiconductor device | |
| JPS532077A (en) | Semiconductor device | |
| JPS54111768A (en) | Semiconductor device of resin sealing type | |
| JPS5578552A (en) | Semiconductor | |
| GB948682A (en) | Semiconductor devices | |
| GB2003335A (en) | Hermetically sealed terminal block and method of manufacture | |
| JPS55153341A (en) | Semiconductor device | |
| JPH0342701B2 (en) | ||
| JPS5429974A (en) | Semiconductor device of resin sealing type | |
| JPS62128547A (en) | Semiconductor device |